Shop

You are here:
  1. Home
  2. Shop
  3. Page 579

AMAT 0010-15708

  • Product Name: Semiconductor Lithography Alignment Component AMAT 0010 - 15708
  • Product Introduction: This component is essential for the alignment process in semiconductor lithography, which is used to transfer circuit patterns onto the wafer surface with high precision. Accurate alignment is crucial for ensuring that the different layers of the semiconductor device are properly registered, which affects the device's performance and functionality. The AMAT 0010 - 15708 is designed to provide reliable and precise alignment in semiconductor lithography equipment.
  • Technical Specifications:
    • Alignment Accuracy: Can achieve alignment accuracy within a few nanometers, ensuring precise overlay of different lithography layers. This is achieved through advanced optical and mechanical alignment technologies.

AMAT 0242-88626

  • Product Name: Advanced Semiconductor Cleaning System Component AMAT 0242 - 88626
  • Product Introduction: This component is a crucial part of semiconductor cleaning systems, which are used to remove contaminants from the wafer surface before and after various manufacturing processes. Contaminants such as particles, organic residues, and metal ions can significantly affect the performance and reliability of semiconductor devices. The AMAT 0242 - 88626 is designed to provide efficient and thorough cleaning of semiconductor wafers.
  • Technical Specifications:
    • Cleaning Methods: Supports multiple cleaning methods, including wet cleaning (using chemical solutions) and dry cleaning (using plasma or gas - phase cleaning techniques). The choice of cleaning method depends on the type of contaminants and the wafer material.

AMAT 0041-46867

  • Product Name: High - Precision Semiconductor Inspection Module AMAT 0041 - 46867
  • Product Introduction: This module is designed for high - precision inspection of semiconductor wafers and devices. Inspection is a critical step in semiconductor manufacturing to detect defects, measure dimensions, and ensure the quality of the final products. The AMAT 0041 - 46867 uses advanced imaging and sensing technologies to provide detailed and accurate inspection results.
  • Technical Specifications:
    • Resolution: Has an ultra - high resolution, capable of detecting defects as small as a few nanometers. This allows for early detection of potential problems in the semiconductor manufacturing process.

AMAT 0040-45149

  • Product Name: Semiconductor Deposition System Component AMAT 0040 - 45149
  • Product Introduction: This component is a key part of semiconductor deposition systems, which are used to deposit thin films of various materials onto the wafer surface. Thin - film deposition is a fundamental step in semiconductor manufacturing, as it forms the basis for creating transistors, capacitors, and other electronic components. The AMAT 0040 - 45149 is designed to improve the quality, uniformity, and efficiency of the deposition process.
  • Technical Specifications:
    • Deposition Rate: Can achieve deposition rates ranging from a few angstroms per minute to several nanometers per minute, depending on the deposition method and material. This allows for precise control over the thickness of the deposited films.

AMAT 0021-35567

  • Product Name: High - Performance Semiconductor Etching Component AMAT 0021 - 35567
  • Product Introduction: This component is an integral part of semiconductor etching equipment. Etching is a critical step in semiconductor manufacturing that involves selectively removing material from the wafer surface to create the desired circuit patterns. The AMAT 0021 - 35567 is designed to enhance the etching process's efficiency, accuracy, and repeatability.
  • Technical Specifications:
    • Etching Rate Control: Can precisely control the etching rate, ranging from a few nanometers per minute to several micrometers per minute, depending on the material being etched and the process requirements.

AMAT 0020-46516

  • Product Introduction: This module is a core component in high - end semiconductor manufacturing equipment. It is specifically designed to handle the complex and precise operations required in modern semiconductor fabrication. Its development is aimed at meeting the increasing demands for smaller feature sizes and higher production yields in the semiconductor industry.
  • Technical Specifications:
    • Material Composition: Constructed from a proprietary blend of high - purity ceramics and metals. The ceramics provide excellent thermal insulation and chemical resistance, while the metals offer high strength and electrical conductivity.

AMAT 0150-04723

Product Name: Wafer Transfer Robot Blade and End Effector Product Introduction: This component is part of the factory automation or internal tool handling system (e.g., on an Endura cluster tool or a standalone clean track). The "Blade" is the flat, extended arm that slides under the wafer. The "End Effector" is the mechanism at the tip of the blade that holds the wafer. It typically uses vacuum channels or mechanical fingers to secure the wafer during transport between cassettes, aligners, and process chambers. Technical Specifications:

  • Material: PEEK (Polyether ether ketone), PFA, or Carbon Fiber composite for low particle generation and high stiffness.

AMAT 0021-42306

Product Introduction: This part is a fluid handling component used in the gas delivery system (Gas Box) of Applied Materials tools. A Mass Flow Controller (MFC) precisely measures and controls the flow rate of a specific process gas (precursor or carrier gas) entering the chamber. This specific part number likely refers to a high-precision MFC module, potentially for reactive or corrosive gases, featuring digital communication and closed-loop control. Technical Specifications:

  • Flow Range: Various ranges available (e.g., 10 sccm, 100 sccm, 1000 sccm, 5 slm) depending on the gas and process.

AMAT 0040-20124

Product Name: Vacuum Chamber Liner and Shielding Kit Product Introduction: This kit consists of the consumable internal shielding components of a process chamber (e.g., for Etch or CVD). The "Liner" is the cylindrical wall coating that protects the main chamber body (usually stainless steel) from corrosive plasma byproducts and sputtering. The "Shield" covers the top and bottom areas. These parts are sacrificial; they are coated with film over time and must be cleaned or replaced periodically to prevent particle fall-off and electrical arcing. Technical Specifications:

  • Material: Anodized Aluminum, Yttrium (Y), or Silicon Carbide (SiC) coated graphite for extreme resistance.

AMAT 0020-78186

Product Name: Electrostatic Chuck (ESC) with Heater and Gas Channel Assembly Product Introduction: This is a core consumable/component for Applied Materials' Producer, Centura, and Endura platforms. The Electrostatic Chuck (ESC) is the "platform" inside the vacuum chamber where the wafer sits. It uses high-voltage electrostatic force (Johnsen-Rahbek effect) to clamp the wafer firmly in place. It also incorporates a backside helium cooling system, resistive heaters for wafer temperature control, and often lift pins for wafer transfer. Technical Specifications:

  • Clamping Voltage: High voltage DC (typically 500V to 2000V) applied via a dielectric layer.

AMAT 3300-07824

Product Name: Optical Endpoint Detection System Module Product Introduction: This component is part of the Applied Materials metrology or process control suite, often found in Etch or CMP tools. It is an optical emission spectroscopy (OES) or laser interferometry system used for "Endpoint Detection." The system monitors the light emitted by the plasma or the interference pattern of a laser beam reflecting off the wafer surface to determine exactly when a specific layer has been completely etched or polished away. Technical Specifications:

  • Sensor Type: CCD array spectrometer or high-speed photodiodes.

AMAT 0020-21104

Product Name: RF Generator and Match Network Sub-Assembly Product Introduction: This part number refers to a critical RF power delivery component used across various Applied Materials platforms (Etch, CVD, PVD). It typically comprises the RF Generator (solid-state or tube-based) and the Automatic Match Network (AMN). The system generates the radio frequency energy required to create and sustain plasma within the process chamber and ensures maximum power transfer by dynamically matching the impedance of the plasma load to the generator. Technical Specifications:

  • Frequency Range: Covers standard industrial frequencies (2 MHz, 13.56 MHz, 27 MHz, 40 MHz, 60 MHz) and VHF bands.