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AMAT 0190-13568

  • Product Introduction: The wafer handling robot is a crucial automated component in semiconductor manufacturing lines. It is designed to precisely and safely transfer semiconductor wafers between different process stations, such as from a load - lock chamber to a processing chamber and vice versa, without causing any damage to the delicate wafers.
  • Technical Specifications:
    • Payload Capacity: It can handle wafers with diameters ranging from 100mm to 300mm and has a payload capacity of up to 2kg per wafer, accommodating different wafer sizes and weights commonly used in semiconductor production.

AMAT 0190-12890

  • Product Introduction: This vacuum pump system is a key component in semiconductor manufacturing equipment that requires a high - vacuum environment, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), and etching systems. It is responsible for creating and maintaining the low - pressure conditions necessary for these processes to occur effectively.
  • Technical Specifications:
    • Pumping Speed: The system has a pumping speed range of 1000 L/s to 10000 L/s, depending on the model and configuration.

AMAT 0190-11567

  • Product Introduction: This gas distribution system is an essential part of semiconductor manufacturing equipment that uses process gases, such as in chemical vapor deposition, etching, and doping processes. It is responsible for accurately and uniformly distributing the process gases to the reaction chamber where the semiconductor wafer is located, ensuring consistent process results.
  • Technical Specifications:
    • Gas Compatibility: It can handle a wide range of process gases, including corrosive gases such as hydrogen fluoride (HF)

AMAT 0190-10234

  • Product Introduction: This system is designed to precisely control the temperature of semiconductor wafers during various manufacturing processes. Temperature control is a critical factor in semiconductor manufacturing as it can significantly affect process parameters such as reaction rates, film uniformity, and stress in the wafer. This system ensures that the wafer is maintained at the optimal temperature for each specific process step.
  • Technical Specifications:
    • Temperature Range: It can control the wafer temperature in the range of - 50°C to 300°C, covering a wide variety of semiconductor manufacturing processes that require different temperature conditions.

AMAT 0050-37282

  • Product Introduction: This optical alignment system is a key component in semiconductor photolithography equipment. Photolithography is a critical process in semiconductor manufacturing that involves transferring circuit patterns from a mask onto a wafer using light. The optical alignment system ensures that the mask and the wafer are precisely aligned, which is essential for achieving high - resolution and accurate pattern transfer.
  • Technical Specifications:
    • Optical Components: It consists of high - quality lenses, mirrors, and beam splitters made of fused silica or other optical materials with high transmittance and low birefringence.

AMAT 0190-09468

  • Product Introduction: This component is a vital part of plasma - based semiconductor manufacturing equipment, such as plasma etchers and plasma - enhanced chemical vapor deposition (PECVD) systems. It is responsible for generating and controlling the plasma, which is a highly energetic state of matter consisting of ions, electrons, and neutral particles. The plasma is used to perform various operations on the semiconductor wafer, such as etching away material or depositing thin films.
  • Technical Specifications:
    • Electrode Material: The electrodes are made of high - purity graphite or silicon - carbide (SiC). Graphite electrodes are suitable for low - to medium - power plasma applications

AMAT 0190-08680

  • Product Introduction: This robot arm is a key component in semiconductor wafer handling systems. It is responsible for the precise and rapid transfer of wafers between different process stations within the semiconductor manufacturing equipment, such as from load locks to process chambers and vice versa. Its high - speed and high - precision operation are essential for improving the overall throughput and yield of the manufacturing process.
  • Technical Specifications:
    • Material: The main structure is made of lightweight and high - strength carbon fiber composite material, which reduces the inertia of the arm and enables faster acceleration and deceleration.

AMAT 0190-02748

  • Product Introduction: This component is an integral part of the vacuum chamber in semiconductor manufacturing equipment. The vacuum chamber is a crucial environment where various processes, such as physical vapor deposition (PVD) and chemical vapor deposition (CVD), take place under extremely low - pressure conditions. This component ensures the integrity and proper functioning of the vacuum chamber.
  • Technical Specifications:
    • Material: Made of high - strength stainless steel 316L, which has excellent vacuum compatibility and can withstand high - vacuum pressures down to 10^-9 Torr.

AMAT 0150-34781

  • Product Introduction: This component is a critical part of advanced semiconductor manufacturing equipment, specifically designed to operate within the high - precision and high - reliability requirements of the semiconductor production environment. It serves as a key element in ensuring the smooth and accurate execution of various manufacturing processes, such as etching, deposition, and lithography.
  • Technical Specifications:
    • Material: Constructed from a proprietary high - purity ceramic - metal composite material. This material offers excellent thermal stability

AMAT 0100-90085

Product Introduction: This alignment system is used in photolithography equipment to accurately align the mask and the wafer during the pattern transfer process. It ensures that the fine patterns on the mask are precisely transferred onto the wafer, which is crucial for the performance of semiconductor devices. Technical Specifications:

  • Uses advanced optical alignment techniques to achieve high - precision alignment.

AMAT 0040-70150

Product Introduction: This thermal processing system is used to perform various heat - related operations on semiconductor wafers, such as annealing, diffusion, and oxidation. It is essential for modifying the electrical and physical properties of semiconductor materials during the manufacturing process. Technical Specifications:

  • Can operate at temperatures up to 1200°C with precise temperature control.
  • Has a uniform heating system to ensure that the wafer is heated evenly across its surface.

AMAT 0150-11044

Product Introduction: This inspection system is designed to detect defects on semiconductor wafers during the manufacturing process. It helps to identify and eliminate defective wafers early, improving the overall yield and quality of semiconductor products. Technical Specifications:

  • Uses advanced optical and electronic imaging techniques to inspect wafers at high speeds.
  • Can detect defects as small as 0.1μm, including particles, scratches, and pattern defects.
  • Has a large field of view to cover the entire wafer surface efficiently.