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AMAT 0150-76735

Product Name: Electrostatic Chuck (ESC) Assembly Product Introduction: A high-voltage device used to hold a semiconductor wafer firmly in place on a pedestal during processing using electrostatic force. It replaces mechanical clamping which causes particle issues. Technical Specifications:

  • Diameter: 300mm (12-inch) standard.
  • Clamping Voltage: 0V to 2000V DC (bipolar or monopolar).

AMAT 0020-19002

Product Name: Process Chamber Liner (Chamber Shield) Product Introduction: A consumable protective shield installed on the inner walls of a vacuum process chamber. It protects the expensive main chamber body from plasma erosion, deposition, and chemical corrosion. Technical Specifications:

  • Material: Aluminum, Aluminum Nitride (AlN), or Silicon Carbide (SiC) depending on process severity.
  • Coating: Yttrium (Y) or Yttria-Alumina for plasma spray resistance.
  • Thickness: 5mm to 20mm.

AMAT 0021-85102

Product Name: Endura Vacuum Robot Blade Product Introduction: A critical handling component used within the vacuum transfer modules of Endura cluster tools. It is the specific end-effector that physically contacts the semiconductor wafer to move it between process stations. Technical Specifications:

  • Material: Carbon fiber reinforced PEEK or Ceramic for low particle generation.
  • Dimensions: Custom geometry to fit specific wafer sizes (200mm or 300mm).

AMAT 0100-91085

Product Name: RF Power Supply Generator (13.56 MHz) Product Introduction: A high-precision Radio Frequency (RF) generator designed to deliver stable power to plasma chambers. It is a core component for generating and sustaining plasma in etching and deposition processes. Technical Specifications:

  • Frequency: 13.56 MHz (standard industrial frequency).
  • Power Output: 1000 Watts to 5000 Watts (configurable).
  • Voltage: 208V/230V/400V AC three-phase input.

AMAT 0010-15708

  • Product Name: Semiconductor Lithography Alignment Component AMAT 0010 - 15708
  • Product Introduction: This component is essential for the alignment process in semiconductor lithography, which is used to transfer circuit patterns onto the wafer surface with high precision. Accurate alignment is crucial for ensuring that the different layers of the semiconductor device are properly registered, which affects the device's performance and functionality. The AMAT 0010 - 15708 is designed to provide reliable and precise alignment in semiconductor lithography equipment.
  • Technical Specifications:
    • Alignment Accuracy: Can achieve alignment accuracy within a few nanometers, ensuring precise overlay of different lithography layers. This is achieved through advanced optical and mechanical alignment technologies.

AMAT 0242-88626

  • Product Name: Advanced Semiconductor Cleaning System Component AMAT 0242 - 88626
  • Product Introduction: This component is a crucial part of semiconductor cleaning systems, which are used to remove contaminants from the wafer surface before and after various manufacturing processes. Contaminants such as particles, organic residues, and metal ions can significantly affect the performance and reliability of semiconductor devices. The AMAT 0242 - 88626 is designed to provide efficient and thorough cleaning of semiconductor wafers.
  • Technical Specifications:
    • Cleaning Methods: Supports multiple cleaning methods, including wet cleaning (using chemical solutions) and dry cleaning (using plasma or gas - phase cleaning techniques). The choice of cleaning method depends on the type of contaminants and the wafer material.

AMAT 0041-46867

  • Product Name: High - Precision Semiconductor Inspection Module AMAT 0041 - 46867
  • Product Introduction: This module is designed for high - precision inspection of semiconductor wafers and devices. Inspection is a critical step in semiconductor manufacturing to detect defects, measure dimensions, and ensure the quality of the final products. The AMAT 0041 - 46867 uses advanced imaging and sensing technologies to provide detailed and accurate inspection results.
  • Technical Specifications:
    • Resolution: Has an ultra - high resolution, capable of detecting defects as small as a few nanometers. This allows for early detection of potential problems in the semiconductor manufacturing process.

AMAT 0040-45149

  • Product Name: Semiconductor Deposition System Component AMAT 0040 - 45149
  • Product Introduction: This component is a key part of semiconductor deposition systems, which are used to deposit thin films of various materials onto the wafer surface. Thin - film deposition is a fundamental step in semiconductor manufacturing, as it forms the basis for creating transistors, capacitors, and other electronic components. The AMAT 0040 - 45149 is designed to improve the quality, uniformity, and efficiency of the deposition process.
  • Technical Specifications:
    • Deposition Rate: Can achieve deposition rates ranging from a few angstroms per minute to several nanometers per minute, depending on the deposition method and material. This allows for precise control over the thickness of the deposited films.

AMAT 0021-35567

  • Product Name: High - Performance Semiconductor Etching Component AMAT 0021 - 35567
  • Product Introduction: This component is an integral part of semiconductor etching equipment. Etching is a critical step in semiconductor manufacturing that involves selectively removing material from the wafer surface to create the desired circuit patterns. The AMAT 0021 - 35567 is designed to enhance the etching process's efficiency, accuracy, and repeatability.
  • Technical Specifications:
    • Etching Rate Control: Can precisely control the etching rate, ranging from a few nanometers per minute to several micrometers per minute, depending on the material being etched and the process requirements.

AMAT 0020-46516

  • Product Introduction: This module is a core component in high - end semiconductor manufacturing equipment. It is specifically designed to handle the complex and precise operations required in modern semiconductor fabrication. Its development is aimed at meeting the increasing demands for smaller feature sizes and higher production yields in the semiconductor industry.
  • Technical Specifications:
    • Material Composition: Constructed from a proprietary blend of high - purity ceramics and metals. The ceramics provide excellent thermal insulation and chemical resistance, while the metals offer high strength and electrical conductivity.

AMAT 0150-04723

Product Name: Wafer Transfer Robot Blade and End Effector Product Introduction: This component is part of the factory automation or internal tool handling system (e.g., on an Endura cluster tool or a standalone clean track). The "Blade" is the flat, extended arm that slides under the wafer. The "End Effector" is the mechanism at the tip of the blade that holds the wafer. It typically uses vacuum channels or mechanical fingers to secure the wafer during transport between cassettes, aligners, and process chambers. Technical Specifications:

  • Material: PEEK (Polyether ether ketone), PFA, or Carbon Fiber composite for low particle generation and high stiffness.

AMAT 0021-42306

Product Introduction: This part is a fluid handling component used in the gas delivery system (Gas Box) of Applied Materials tools. A Mass Flow Controller (MFC) precisely measures and controls the flow rate of a specific process gas (precursor or carrier gas) entering the chamber. This specific part number likely refers to a high-precision MFC module, potentially for reactive or corrosive gases, featuring digital communication and closed-loop control. Technical Specifications:

  • Flow Range: Various ranges available (e.g., 10 sccm, 100 sccm, 1000 sccm, 5 slm) depending on the gas and process.