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AMAT 0040-01239

Product Name: Electrostatic Chuck (ESC) for Etch/Deposition Systems Product Introduction: The 0040-01239 is an Electrostatic Chuck (ESC) assembly used in various Applied Materials process modules (both etch and deposition). The ESC is the platform on which the wafer sits inside the vacuum chamber. It uses electrostatic force (Coulomb or Johnsen-Rahbek effect) to hold the wafer firmly in place, even under high vacuum and during plasma bombardment. It also typically incorporates a helium backside cooling system to control wafer temperature. Technical Specifications:

  • System Compatibility: Multi-chamber platforms (e.g., DPS, Eterna)

AMAT 0010-10901

Product Name: 300mm Endura Volta HD+ PVD Chamber Component Kit (Collimator/Shield) Product Introduction: This kit is a major maintenance hardware set for the Applied Materials Endura Volta HD+ PVD system. It is designed to refresh the internal chamber environment to "like-new" condition. The Volta HD+ is a high-density plasma source used for filling small features with copper. The kit typically includes the collimator, chamber liners, and various shields that have been eroded by the intense plasma bombardment over thousands of wafers. Technical Specifications:

  • System Compatibility: Endura Volta HD+ (300mm)

AMAT 0010-29083

Product Name: Endura Cirrus PVD Chamber Liner Kit Product Introduction: The 0010-29083 is a comprehensive chamber liner and shield kit for the Applied Materials Endura Cirrus PVD system. The Cirrus platform is specialized for Ionized Metal Plasma (IMP) deposition, which is essential for sub-quarter-micron metallization. This kit includes the chamber walls, bottom shields, and target shields that protect the main chamber from sputter coating and plasma erosion. These liners are sacrificial components replaced periodically during preventive maintenance. Technical Specifications:

  • System Compatibility: Applied Materials Endura Cirrus PVD

AMAT 4020-00084

Product Name: DPS II RF Match Network for Etch Systems Product Introduction: This is an RF Match Network specifically designed for the Applied Materials Decoupled Plasma Source (DPS) II etch systems, such as the Flex or Kiyo platforms. In plasma etching, maintaining a stable plasma is crucial for anisotropic etching profiles. The match network sits between the RF generator and the plasma source coil (antenna). It matches the impedance of the generator (typically 50 ohms) to the impedance of the plasma load, which varies dynamically during the etch process. Technical Specifications:

  • System Compatibility: Applied Materials DPS II Etch Modules (e.g., Flex, Kiyo)

AMAT 0190-53515

Product Name: PVD Focusing Ring Assembly Product Introduction: The 0190-53515 is a consumable hardware component used in Applied Materials PVD chambers (such as the Endura series). It is a ring-shaped structure, typically made of aluminum or a dielectric material, placed around the edge of the wafer or inside the chamber near the target. Its primary function is to shape the plasma density profile and control the electric field lines at the wafer edge, preventing the "edge effect" where deposition rates and film properties differ at the wafer periphery. Technical Specifications:

  • System Compatibility: Various Applied Materials PVD Systems (Endura, SIP)

AMAT 0150-76175

Product Name: Endura Impulse PVD Collimator/Target Assembly Component Product Introduction: This part number refers to a specific component within the Endura Impulse PVD system, typically associated with the collimator or the target assembly. The Impulse system is designed for Ionized Metal Plasma (IMP) deposition, which provides superior bottom and sidewall coverage compared to traditional sputtering. The collimator is a honeycomb-like structure that filters out neutral atoms, allowing only ionized metal atoms to reach the wafer at a specific angle. Technical Specifications:

  • System Compatibility: Applied Materials Endura Impulse PVD

AMAT 0020-22801

Product Name: Producer GT CVD Precursor Gas Distribution Manifold Product Introduction: The 0020-22801 is a specialized gas delivery manifold designed for the Applied Materials Producer GT CVD system. This system is often used for high-throughput dielectric deposition. The manifold distributes reactive gases evenly across the 300mm wafer surface. It is a critical component for controlling film uniformity, deposition rate, and film quality. The internal flow paths are engineered to handle aggressive chemistries without corroding or generating particles. Technical Specifications:

  • Equipment Match: Applied Materials Producer GT CVD Chamber

AMAT 0051-01978

Product Name: Endura Vacuum Lock Valve Pneumatic Actuator Assembly Product Introduction: This component is a high-vacuum isolation valve actuator assembly used primarily in Applied Materials Endura PVD and CVD systems. It serves as the gatekeeper between the central transfer chamber (maintained at high vacuum) and the process modules or load locks. The actuator provides the mechanical force to open or close the valve gate, ensuring that the vacuum integrity of the system is maintained during wafer transfer and processing. Technical Specifications:

  • System Compatibility: Applied Materials Endura Series (Centura and Integrated Platforms)

AMAT 3870-01300

Product Name: Producer XP CVD Showerhead Gas Injection Assembly Product Introduction: The 3870-01300 is a precision-engineered gas distribution manifold, commonly referred to as a "showerhead," used in the Applied Materials Producer XP Chemical Vapor Deposition (CVD) system. It is responsible for introducing precursor gases (such as silane, ammonia, or TEOS) into the process chamber in a highly uniform manner. The design ensures that gas flows laminarly across the wafer surface, which is essential for achieving uniform film thickness, stoichiometry, and step coverage. Technical Specifications:

  • Equipment Match: Applied Materials Producer XP CVD Chamber

AMAT 9090-00115

Product Name: Endura Volta HD+ Source RF Match Network Assembly Product Introduction: This assembly is a critical radio frequency (RF) impedance matching unit designed specifically for the Applied Materials Endura Volta HD+ Physical Vapor Deposition (PVD) system. It is engineered to maximize power transfer from the RF generator to the plasma source within the sputtering chamber. By dynamically adjusting capacitance and inductance, it ensures that the plasma ignites and sustains efficiently, minimizing reflected power which can damage sensitive RF components. This unit is integral to high-density plasma (HDP) processes used in advanced copper metallization. Technical Specifications:

  • System Compatibility: Applied Materials Endura Volta HD+ PVD Cluster Tool

AMAT 0020-22801

Product Introduction: This part is a critical gas delivery component for the Applied Materials Producer GT CVD system, used primarily for dielectric deposition. The manifold ensures uniform distribution of precursor gases across the surface of the wafer to achieve consistent film thickness and stoichiometry. Technical Specifications:

  • Equipment Match: Producer GT CVD Chamber
  • Function: Gas Injection and Distribution

AMAT 0010-29083

Product Introduction: The 0010-29083 is a chamber hardware kit for the Applied Materials Endura Cirrus PVD platform. The Cirrus system is renowned for its capability in ionized metal plasma (IMP) deposition, particularly for barrier and seed layers. This assembly protects the chamber walls from sputter coating and plasma erosion. Technical Specifications:

  • System Compatibility: Endura Cirrus PVD System
  • Material Composition: Titanium or Tantalum coated stainless steel (for shields), Aluminum (for liners)