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AMAT 0010-29083
Product Introduction: The 0010-29083 is a chamber hardware kit for the Applied Materials Endura Cirrus PVD platform. The Cirrus system is renowned for its capability in ionized metal plasma (IMP) deposition, particularly for barrier and seed layers. This assembly protects the chamber walls from sputter coating and plasma erosion.
Technical Specifications:
- System Compatibility: Endura Cirrus PVD System
- Material Composition: Titanium or Tantalum coated stainless steel (for shields), Aluminum (for liners)
Detailed content
- Component Includes: Chamber liner, process kit, shadow frame, and isolation rings.
- Vacuum Compatibility: Ultra-high vacuum (UHV) compatible, baked to <1×10^-9 Torr base pressure.
Functional Features: - Erosion Resistance: Utilizes high-purity materials with high melting points to resist physical bombardment by energetic ions.
- Gettering Capability: Acts as a sacrificial surface to trap impurities and oxygen, preventing them from contaminating the deposited film.
- RF Grounding: Integrated design ensures proper RF grounding paths to maintain plasma stability.
- Seasoning Capability: Designed to be “seasoned” (pre-coated) to stabilize the process before production wafers are run.
Application Scenarios: - Deposition of Tantalum (Ta) and Tantalum Nitride (TaN) barrier layers.
- Copper seed layer deposition for electroplating.
- Advanced metallization schemes for 3D NAND and DRAM memory devices.
- Processes requiring precise control over impurity levels and film stress.
