Product Description: This part number typically identifies a specific sub-assembly, often a Chuck Heater Assembly or a Thermal Control Module for Gasonics plasma strip tools. It is a critical component responsible for maintaining precise temperature control of the wafer during processing, which is essential for controlling etch rates and preventing thermal stress. Technical Specifications:
Product Description: The Gasonics GL139 is a legacy or specialized configuration of a plasma stripping system, often categorized within the Gasonics line of downstream plasma ashers. It is designed specifically for the removal of photoresist and organic residues from semiconductor wafers using a low-damage, radical-based plasma process. The system separates the plasma generation zone from the wafer surface to prevent ion bombardment damage. Technical Specifications:
Product Description: This model is a specific revision (001) of the AWD-D-1-4-10 configuration. The "10" may refer to a 10-slot cassette handler or a 10-zone showerhead design. It is a high-end automated plasma stripping system designed for the most demanding production environments, featuring advanced process control and redundancy. Technical Specifications:
Product Description: The Gasonics AWD-D-1-4-9 is a configuration within the AWD-D family, likely indicating a specific tool revision ("9") or a configuration optimized for 9 specific process gases. It is a downstream plasma asher/stripper designed for high uniformity and low damage processing of semiconductor wafers. Technical Specifications:
Product Description: The Gasonics AWD-D-1-4-11 is a variant of the AWD-D series plasma strip tool. The "11" suffix often denotes a specific hardware generation or a configuration with an 11-liter chamber volume or specific pump configuration. It is a robust system designed for 200mm and 300mm wafer processing capabilities in a decoupled plasma source architecture. Technical Specifications:
Product Description: This part number refers to a specific sub-system or kit for the AWD-D series, likely a 5-inch component or a configuration related to a 5-zone temperature control system. Alternatively, in some naming conventions, it refers to a specific "Type 1" chamber with "4" gas lines and a "5" kW generator configuration (001 revision). It is a specialized configuration for high-power ashing. Technical Specifications:
Product Description: The Gasonics AWD-D-1-4-8 is a compact, high-efficiency plasma stripping system. The nomenclature suggests a single-chamber tool ("1") configured for specific process modules ("4") capable of handling 200mm ("8-inch") wafers. It is designed for standalone operation or integration into smaller lab-scale or pilot-line clusters. Technical Specifications:
Product Description: This model represents a specific configuration of the Gasonics AWD-D series, likely a single-chamber or dual-chamber tool optimized for 150mm (6-inch) and specific niche applications. The "10-002" suffix often indicates a specific hardware revision or a configuration with a 10kW power option or specific chamber dimension. It is a high-performance photoresist stripper using downstream plasma technology. Technical Specifications:
Product Description: The Gasonics AWD-D-2-8-8 is a dual-chamber automated wet decoupling system. The "D" denotes a Dual configuration, allowing for simultaneous processing or sequential processing of two wafers to increase throughput. The "2-8-8" typically indicates a 2-chamber setup capable of processing 8-inch wafers with specific process module configurations. Technical Specifications:
Product Description: This part number identifies a specific RF Match Network or Impedance Matching Circuit used in Gasonics plasma systems. The match network is critical for transferring maximum power from the RF generator to the plasma load, ensuring stable ignition and efficient operation. Technical Specifications:
Product Description: The Gasonics AWD-1-7 is an Automated Wet Decoupling (AWD) system, specifically a single-chamber configuration designed for photoresist stripping and wafer cleaning. It utilizes a combination of chemical baths and plasma ashing techniques to remove organic materials from semiconductor wafers. The "1-7" designation often refers to the chamber configuration and wafer size capability. Technical Specifications:
Product Description: This part number typically refers to a specific sub-assembly or component kit within the Gasonics wet bench or plasma strip systems. It is often associated with the gas distribution manifold or a specific replacement kit for the reaction chamber. It is designed to maintain the integrity of high-purity process environments and ensure consistent delivery of process gases. Technical Specifications:
