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Gasonics AWD-D-1-4-9
Product Description: The Gasonics AWD-D-1-4-9 is a configuration within the AWD-D family, likely indicating a specific tool revision (“9”) or a configuration optimized for 9 specific process gases. It is a downstream plasma asher/stripper designed for high uniformity and low damage processing of semiconductor wafers.
Technical Specifications:
- System Architecture: Downstream Plasma Source with Radial Gas Injection
Detailed content
- Wafer Size: 150mm, 200mm
- RF Power: 1000W – 4000W @ 13.56 MHz
- Gas Configuration: 4 primary gases with expandability to 9 gas lines
- Pressure Range: 50 mTorr to 1000 mTorr
- Temperature: RT to 200°C (Chuck heating option)
Functional Features:
- Radial Uniformity: Gas injection ring designed for optimal radial uniformity of plasma radicals across the wafer surface.
- Low UV Emission: Special chamber materials and mesh design to block harmful UV radiation.
- Process Library: Pre-loaded recipes for common photoresist types (AZ, Shipley, etc.).
- Maintenance Access: Front-opening or top-opening design for easy electrode and chamber liner replacement.
Application Scenarios:
- CMOS Image Sensors: Critical cleaning steps where microlenses and color filters are present.
- DRAM/NAND Flash: Post-etch residue removal in memory devices.
- Discrete Components: Processing of diodes, transistors, and thyristors.
- LED Manufacturing: Cleaning of sapphire substrates for LED growth.
