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Gasonics AWD-D-1-4-11
Product Description: The Gasonics AWD-D-1-4-11 is a variant of the AWD-D series plasma strip tool. The “11” suffix often denotes a specific hardware generation or a configuration with an 11-liter chamber volume or specific pump configuration. It is a robust system designed for 200mm and 300mm wafer processing capabilities in a decoupled plasma source architecture.
Technical Specifications:
- Chamber Volume: Optimized for 300mm wafer compatibility (if applicable) or high-throughput 200mm processing
Detailed content
- RF System: Dual-frequency capability (e.g., 2MHz and 13.56MHz) for independent control of ion energy and radical density
- Pump System: High-capacity cryogenic pump or turbo pump for fast processing
- Gas Handling: 4-6 gas lines with high-flow MFCs
- Particle Performance: Class 1 particle performance (less than 1 particle >0.2um per wafer)
Functional Features:
- Dual Frequency: Allows decoupling of ion bombardment (controlled by low frequency) and chemical reaction (controlled by high frequency), optimizing the strip rate vs. damage trade-off.
- Cryogenic Trapping: Integrated cold traps to capture volatile byproducts and prevent pump oil backstreaming.
- Automated Chamber Conditioning: Seasoning of the chamber walls to stabilize process results over time.
- SEC/GEM Interface: Standard communication interface for factory automation (SECS/GEM).
Application Scenarios:
- 300mm Logic/Memory Fabs: High-volume production of advanced semiconductor nodes.
- TSV Processing: Through-Silicon Via processing where deep hole cleaning is required.
- Advanced Packaging: Cleaning for Fan-Out Wafer Level Packaging (FOWLP).
- Power Semiconductors: Processing of IGBT modules and SiC power devices.
