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AMAT 0041-93175

Product Name: Turbo Pump Interface / Adapter Flange
Product Description: A precision-machined transition flange that provides a vacuum-tight connection between the process chamber and high-speed turbomolecular vacuum pump. It ensures alignment, structural support, and maintains UHV integrity.
Technical Specifications:
  • Material: Forged aluminum alloy 6061-T6 / 316L stainless steel

AMAT 0140-36112

Product Name: AC Power Distribution Cable Assembly – Ozone Generator

Product Description: A heavy-duty, industrial-grade power cable assembly designed to safely deliver alternating current from the main power distribution unit to the ozone generator module in semiconductor wafer cleaning systems.
Technical Specifications:
  • Cable Type: Multi-conductor, shielded power cable

AMAT 0020-48304

Product Name: Process Shield / Chamber Liner Assembly
Product Description: A consumable protective liner installed within the process chamber to shield the chamber wall from plasma bombardment, chemical corrosion, and deposition of process byproducts. It optimizes gas flow and extends chamber maintenance intervals.
Technical Specifications:
  • Material: High-purity, plasma-sprayed coated aluminum or SiC composite

AMAT 0021-84531

Product Name: High-Purity Ceramic Insulator / Isolation Ring
Product Description: A precision-engineered ceramic component providing electrical isolation, thermal stability, and mechanical support within high-power RF and plasma environments. It prevents arcing, isolates high-voltage components, and maintains structural alignment.
Technical Specifications:
  • Material: Ultra-high-purity (99.9%) alumina (Al₂O₃) ceramic

AMAT 0010-22012

Product Name: Electrostatic Chuck (ESC) Pedestal Assembly
Product Description: A high-performance wafer clamping and heating pedestal integrating electrostatic chucking technology with precise thermal control. It provides non-contact wafer clamping, uniform heating, and RF bias delivery for advanced semiconductor processes.
Technical Specifications:
  • Wafer Size: Compatible with 200mm wafers

AMAT 0010-00750

Product Name: Bolt-Down Cover / Chamber Top Plate Assembly

Product Description: A robust, precision-machined top cover assembly engineered to secure and seal process chamber environments. It serves as a structural barrier and mounting platform for internal fixtures, ensuring vacuum integrity and process stability.
Technical Specifications:
  • Material: Solid 316L stainless steel or high-grade aluminum alloy

AMAT 0010-09822

Product Name: Precision Machined Chamber Lid / Bolt-Down Cover Assembly
Product Description: A high-precision, heavy-duty structural cover assembly designed to seal the top opening of semiconductor process chambers. It provides a vacuum-tight seal, structural integrity, and mounting interface for internal components while maintaining ultra-clean conditions.
Technical Specifications:
  • Material: High-strength, low-outgassing 6061-T6 aluminum alloy

AMAT 0100-70028

Product Name: Embedded Control PCB & Field I/O Processor Module
Product Description: An industrial‑grade embedded control circuit board and subsystem processor module, used for real‑time control, data acquisition, motion control and communication management of various actuators, sensors and execution components in semiconductor equipment.
Technical Specifications:
  • Processor: High‑performance embedded industrial processor

AMAT 0021-26276

Product Name: High‑Purity Quartz & Ceramic Process Kit Component
Product Description: A precision component made of ultra‑high‑purity quartz or advanced ceramic, used as gas distribution ring, focus ring, insulation ring, process kit insert and optical window in the process chamber to ensure process stability and low contamination.
Technical Specifications:
  • Material: Ultra‑high‑purity fused silica quartz, high‑purity alumina ceramic or silicon carbide

AMAT 0190-24298

Product Name: High‑Power RF Coaxial Cable & Transmission Assembly
Product Description: A professional high‑power, low‑loss RF coaxial cable assembly designed for semiconductor plasma equipment, used to transmit high‑power RF energy from RF generator to matching network and process chamber, ensuring stable plasma excitation.
Technical Specifications:
  • Impedance: Standard 50Ω impedance matching

AMAT 0040-38858

Product Name: Utility Interface Panel & Gas Distribution Manifold
Product Description: A centralized interface panel and gas distribution manifold used for process chamber utility connection, realizing the integrated access of process gas, purge gas, vacuum pipeline, cooling water circuit and signal circuit, and ensuring the stability and safety of fluid and electrical transmission.
Technical Specifications:
  • Material: 316L stainless steel, electropolished aluminum alloy

AMAT 0040-09312

Product Name: Main Vacuum Chamber Body & Structural Shell Assembly
Product Description: The main structural shell and vacuum cavity body of semiconductor process equipment, providing a closed ultra‑high vacuum environment for wafer processing. It integrates various functional interfaces and has high structural rigidity and vacuum integrity.
Technical Specifications:
  • Material: Low‑outgassing high‑strength aluminum alloy or 316L stainless steel