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AMAT 0040-49965

Product Name: 300mm Grooved Retaining Ring (Titan Head)
Product Description: A high-performance retaining ring component for the Titan Head polishing assembly on AMAT Mirra CMP (Chemical Mechanical Planarization) systems. It securely holds the wafer in place during the polishing process.
Technical Specifications:
  • Wafer Size: 300mm (12-inch).

AMAT 0010-21740

Product Name: TC AMP Assembly (Thermocouple Amplifier Assembly)
Product Description: A precision signal conditioning module designed to amplify and process low-level thermocouple signals for accurate temperature measurement within semiconductor process chambers. It is engineered for high signal stability and noise immunity in high-vacuum and high-temperature industrial environments.
Technical Specifications:
  • Compatibility: Optimized for 300mm wafer processing systems.

AMAT 0100-02409

Product Name: High-Density Multi-Channel I/O Interface Circuit Board Assembly
Product Description: This is a high-performance input/output interface circuit board for semiconductor equipment control systems. It serves as a bridge between the main controller and on-site sensors, actuators and execution mechanisms, responsible for signal acquisition, drive output and data interaction.
Technical Specifications:
  • Multi-channel analog input/output: 0–10V, 4–20mA standard signal

AMAT 0051-01848

Product Name: High-Purity Vacuum Exhaust Manifold & Pipeline Fitting Assembly
Product Description: This is a high-purity vacuum exhaust manifold and pipe fitting assembly for semiconductor process equipment, used for the collection, shunting and discharge of process exhaust gas. It ensures smooth gas flow under ultra-high vacuum and resists corrosion of special process gases.
Technical Specifications:
  • Material: 316L stainless steel with electrolytic polishing on inner surface, Ra ≤ 0.4μm

AMAT 0021-21814

Product Name: High-Temperature Thermal Insulation and Shielding Component Assembly
Product Description: This is a thermal management component used in high-temperature semiconductor process chambers, mainly used for thermal insulation, temperature uniformity control and heat source shielding. It is suitable for high-temperature processes such as deposition and annealing to stabilize process temperature field.
Technical Specifications:
  • Main materials: high-purity ceramic, high-temperature composite fiber and special thermal insulation materials

AMAT 0270-90163

Product Name: Ultra-Precision Component Centering and Alignment Fixture Assembly
Product Description: This is a professional precision tooling fixture for semiconductor equipment, used for centering, alignment and positioning assembly of core components in process chambers. It is widely used in equipment assembly, maintenance and upgrading to ensure the positional accuracy of key components.
Technical Specifications:
  • Material: high-strength aluminum alloy with heat stabilization treatment, low thermal deformation

AMAT 0270-20069

Product Name: 8" Wafer Cassette Indexer to Robot Calibration Plate Fixture
Product Description: This is a precision calibration jig used to calibrate the relative position between wafer cassette indexer and automatic handling robot. It provides a unified mechanical reference standard to eliminate positioning deviation, ensuring accurate and stable wafer grabbing and placing actions.
Technical Specifications:
  • Applicable specification: 8-inch (200mm) wafer cassette system

AMAT 0010-77533

Product Name: 200mm MIRRA Titan 1 CMP Polishing Head Assembly
Product Description: This is a special polishing head assembly designed for Applied Materials MIRRA chemical mechanical planarization (CMP) system, specially used for 200mm wafer surface polishing. It realizes uniform pressure application, stable wafer clamping and efficient slurry distribution, ensuring the global and local flatness of wafer surface.
Technical Specifications:
  • Applicable wafer size: 200mm (8-inch) semiconductor wafers

AMAT 0100-00472

Product Name: High-Speed Motion Control Processor PCB Module
Product Description: This is a dedicated motion control circuit board module for semiconductor automation equipment, responsible for closed-loop control of wafer handling robots, precision platforms and servo drives. It realizes high-precision positioning, speed control and action sequence logic, ensuring the stability and accuracy of wafer transmission.
Technical Specifications:
  • Built-in 32-bit high-performance motion control processor

AMAT 0040-03608

Product Name: High-Precision Vacuum Chamber Structural Component Assembly
Product Description: This is a precision-machined core structural assembly for semiconductor vacuum process chambers, widely used in PVD, CVD and etching systems. It provides stable mechanical support and airtight sealing for the internal environment of the chamber, ensuring the stability of the process under ultra-high vacuum and plasma conditions.
Technical Specifications:
  • Main material: high-purity 6061-T6 aluminum alloy with precision CNC machining

AMAT 0200-23278

Product Name: Integrated Equipment Operator Control Console & Human-Machine Interface System
Product Description: This component is a dedicated main control console and human-machine interaction unit for high-end semiconductor manufacturing equipment, mainly used in etching, deposition, and thin-film process platforms. It integrates system monitoring, parameter configuration, fault diagnosis, and process control functions, serving as the core operation hub for equipment commissioning, daily production, and maintenance.
Technical Specifications:
  • Industrial-grade high-resolution liquid crystal display with anti-glare and cleanroom-compatible surface

AMAT 0240-76625

Product Name: Mainframe Controller Interface PCB
Product Description: A critical printed circuit board that manages communication and control signals between the tool mainframe and all process modules. Ensures synchronized operation and data acquisition.
Technical Specifications:
  • Processor: 32-bit RISC microcontroller