AMAT 0010-77533
Product Name: 200mm MIRRA Titan 1 CMP Polishing Head Assembly
Product Description: This is a special polishing head assembly designed for Applied Materials MIRRA chemical mechanical planarization (CMP) system, specially used for 200mm wafer surface polishing. It realizes uniform pressure application, stable wafer clamping and efficient slurry distribution, ensuring the global and local flatness of wafer surface.
Technical Specifications:
- Applicable wafer size: 200mm (8-inch) semiconductor wafers




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