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AMAT 0100-02715

Product Name: High-Performance Field Control Processor Module
Product Description: A compact, embedded control module serving as the core processing unit for semiconductor equipment subsystems, managing real-time control, I/O operations, and communication with mainframe controllers.
Technical Specifications:
  • Processor: 32-bit high-speed embedded controller

AMAT 0041-89200

Product Name: Dual-Zone Electrostatic Chuck Heater Assembly
Product Description: An integrated heating element assembly embedded within electrostatic chucks (ESC), providing precise, dual-zone temperature control for wafers during advanced semiconductor deposition and etching processes.
Technical Specifications:
  • Heating Element: High-purity tungsten resistance heating circuit

AMAT 0040-86514

Product Name: High-Purity Quartz Pedestal Support Ring
Product Description: A precision-machined fused quartz component designed to support and insulate wafer pedestals in semiconductor PVD chambers, ensuring stable wafer positioning and electrical isolation during high-vacuum deposition processes.
Technical Specifications:
  • Material: High-purity synthetic fused silica (SiO₂), purity ≥99.99%

AMAT 0500-01065

Product Name: High‑Precision Vacuum Pressure Sensor Assembly
Product Description: A high‑accuracy pressure measurement device used to monitor and control vacuum levels in process chambers, load locks, and gas lines.
Technical Specifications:
  • Sensing Type: Piezoresistive or capacitance manometer

AMAT 0021-07905

Product Name: High‑Voltage Ceramic Insulator Spacer
Product Description: A precision‑machined ceramic component used to electrically isolate and physically support electrodes, chucks, and chamber components in high‑voltage plasma environments.
Technical Specifications:
  • Material: High-purity alumina ceramic (Al₂O₃), ≥99.6% purity

AMAT 0010-09652

Product Name: Wafer Indexer Control PCB Assembly
Product Description: A dedicated control board that manages the motion, positioning, and synchronization of wafer indexer mechanisms in multi‑chamber semiconductor platforms.
Technical Specifications:
  • Processor: 32-bit high-speed embedded controller

AMAT 0021-13217

Product Name: Plasma‑Resistant Chamber Shield Assembly
Product Description: A consumable shield assembly that lines the inner chamber wall to capture sputtered materials, confine plasma, and protect the main chamber body from damage.
Technical Specifications:
  • Material: High-purity aluminum with anodized or ceramic coating

AMAT 0040-09095

Product Name: High-Purity Quartz Gas Distribution Insert
Product Description: A fused silica component designed to uniformly distribute process gases inside semiconductor chambers while maintaining chemical inertness and high purity.
Technical Specifications:
  • Material: High-purity synthetic fused quartz (SiO₂), ≥99.99% purity

AMAT 0100-01652

Product Name: Closed-Loop Motor Driver PCB Assembly
Product Description: A control circuit board that drives and regulates precision motors used in wafer handling, valve actuation, and chamber adjustment mechanisms.
Technical Specifications:
  • Input Voltage: 24V DC

AMAT 0040-34815

Product Name: High-Temperature Electrostatic Chuck Cover Ring
Product Description: A precision-machined component installed around the electrostatic chuck (ESC) to protect the ESC edge, stabilize plasma distribution, and improve wafer temperature uniformity.
Technical Specifications:
  • Material: High-purity ceramic or high-performance polymer composite

AMAT 0190-41186

Product Name: RF Match Network Tuning Drive Assembly
Product Description: A precision electromechanical drive unit that automatically adjusts the positions of variable capacitors in RF impedance matching networks to maintain optimal power transfer to plasma loads.
Technical Specifications:
  • Motor Type: High-precision stepper motor with encoder feedback

AMAT 0140-00031

Product Name: High-Voltage Power Interconnect Cable Assembly
Product Description: A heavy-duty power cable assembly engineered for stable power transmission in high-power sections of semiconductor processing equipment, with strong anti-interference performance.
Technical Specifications:
  • Conductor: High-purity multi-strand tinned copper wire