Shop

You are here:
  1. Home
  2. Shop
  3. Page 576

AMAT 0070-25648

  • Product Introduction: This mass flow controller is a key component in semiconductor process gas delivery systems. It is used to precisely control the flow rate of process gases, which is crucial for maintaining consistent process conditions and ensuring the quality and reliability of semiconductor devices. The mass flow controller can accurately measure and regulate the gas flow within a specified range, regardless of changes in pressure or temperature.
  • Technical Specifications:
    • Flow Range: Can handle a wide flow range, from very low flow rates in the sccm (standard

AMAT 0060-17832

  • Product Name: AMAT 0060 - 17832 Semiconductor Wafer Thickness Gauge
  • Product Introduction: This thickness gauge is an essential tool in semiconductor manufacturing for accurately measuring the thickness of semiconductor wafers. Wafer thickness is a critical parameter that affects the mechanical strength, electrical performance, and overall quality of the semiconductor devices. The gauge provides real - time thickness measurements during the manufacturing process, allowing for process control and quality assurance.

AMAT 0040-03799

  • Technical Specifications:
    • Heating Material: Made from high - temperature - resistant materials such as kanthal alloy or silicon carbide. Kanthal alloy offers good electrical conductivity and can withstand high temperatures up to around 1400°C, while silicon carbide can operate at even higher temperatures, up to 1600°C or more, and has excellent thermal conductivity.
    • Power Rating: Has a specific power rating, usually measured in watts. The power rating is determined based on the size of the process chamber and the required heating rate. For example, a small - scale process chamber may use a heating element with a power rating of a few hundred watts, while larger chambers may require several kilowatts of power.

AMAT 0100-00137

  • Product Name: AMAT 0100 - 00137 Semiconductor Wafer Edge Grinding Wheel
  • Product Introduction: This grinding wheel is specifically designed for the edge grinding process of semiconductor wafers. Wafer edge grinding is an important step in semiconductor manufacturing to remove the sharp edges and bevel the wafer edges. This helps to reduce the risk of wafer breakage during handling and subsequent processing steps, and also improves the overall quality and performance of the semiconductor devices.
  • Technical Specifications:
    • Abrasive Material: Made from high - quality abrasive materials such as diamond or cubic boron nitride (CBN).

AMAT 0021-39721

  • Product Name: AMAT 0021 - 39721 Semiconductor Process Gas Filter
  • Product Introduction: This gas filter is an essential component in semiconductor process gas delivery systems. Semiconductor manufacturing processes rely on the use of high - purity gases for various operations such as deposition, etching, and doping. The filter is designed to remove particulate contaminants, moisture, and other impurities from the process gases to ensure the quality and reliability of the semiconductor devices being produced.
  • Technical Specifications:
    • Filtration Rating: Has a high filtration rating, typically in the range of sub - micrometers. For example,

AMAT 0050-21180

  • Product Name: AMAT 0050 - 21180 Semiconductor Wafer Cleaning System Nozzle
  • Product Introduction: This nozzle is a critical component of semiconductor wafer cleaning systems. Wafer cleaning is an essential step in semiconductor manufacturing to remove contaminants such as particles, organic residues, and metal ions from the wafer surface before and after various process steps. The nozzle is responsible for delivering cleaning fluids, such as deionized water, chemicals, or a combination of both, in a precise and controlled manner to achieve effective cleaning.
  • Technical Specifications:
    • Material: Made from high - purity, chemically resistant materials such as polyether ether ketone (PEEK) or special ceramics.

AMAT 3300-11385

  • Product Introduction: This automated robot arm is a key element in semiconductor wafer handling systems. It is designed to precisely and rapidly move semiconductor wafers between different processing stations within a semiconductor fab, such as from load ports to process chambers and between different chambers during multi - step processes. Its high - precision operation and reliability are crucial for maintaining high production yields and minimizing wafer damage.
  • Technical Specifications:
    • Degrees of Freedom: Typically has multiple degrees of freedom, usually 4 - 6, which allow it to move in the X, Y, and Z directions as well as rotate around different axes.

AMAT 0020-34362

  • Product Introduction: This component is a vital part of semiconductor process chambers, which are the core areas where various semiconductor manufacturing processes such as chemical vapor deposition (CVD), physical vapor deposition (PVD), and etching take place. It is engineered to withstand extreme process conditions, including high temperatures, high - pressure differentials, and corrosive chemical environments, ensuring the stability and reliability of the entire semiconductor manufacturing process.
  • Technical Specifications:
    • Material: Constructed from high - purity, corrosion - resistant alloys such as Hastelloy or special stainless steels.

AMAT 0010-07409

Product Introduction: This is a high-frequency RF power supply designed to deliver precise amounts of RF energy into the plasma process chamber. It converts utility power into RF energy at specific frequencies (e.g., 13.56 MHz, 2 MHz, 60 MHz, or 27 MHz). Modern units are solid-state, offering high efficiency and fast control. Technical Specifications:

  • Type: Solid State Amplifier (SSA) or Tube-based (Triode/Tetrode).

AMAT 0010-00015

Product Introduction: This part number typically refers to a comprehensive kit of consumable spare parts required for the preventive maintenance (PM) of a specific process chamber. It ensures that all wear-prone components are replaced simultaneously to restore the chamber to its "as-new" performance specifications.1. Kit Contents (Typical):

  • Showerhead: Gas distribution plate.1.
  • Liner: Chamber wall shield.

AMAT 64-81813-00

Product Introduction: This is a high-precision heating assembly, often integrated into the electrostatic chuck or wafer pedestal. It uses resistive heating elements embedded within a ceramic body (usually Aluminum Nitride for high thermal conductivity) to heat the wafer to processing temperatures ranging from room temperature to several hundred degrees Celsius. Technical Specifications:

  • Core Material: Aluminum Nitride (AlN) or Alumina.1.

AMAT 0050-81422

Product Introduction: The Electrostatic Chuck is the heart of the wafer handling system in plasma processors. It holds the wafer securely in place using electrostatic force (Johnsen-Rahbek or Coulomb force) generated by high voltage DC. It also typically incorporates a helium backside cooling system to control the wafer temperature during high-power processing. Technical Specifications:

  • Type: Johnsen-Rahbek (JR) or Coulomb.
  • Material: Aluminum Nitride (AlN) or Alumina (Al2O3) ceramic.