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AMAT 0100-00137
- Product Name: AMAT 0100 – 00137 Semiconductor Wafer Edge Grinding Wheel
- Product Introduction: This grinding wheel is specifically designed for the edge grinding process of semiconductor wafers. Wafer edge grinding is an important step in semiconductor manufacturing to remove the sharp edges and bevel the wafer edges. This helps to reduce the risk of wafer breakage during handling and subsequent processing steps, and also improves the overall quality and performance of the semiconductor devices.
- Technical Specifications:
- Abrasive Material: Made from high – quality abrasive materials such as diamond or cubic boron nitride (CBN).
Detailed content
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- Diamond is often preferred for its extreme hardness and wear resistance, which allows for long – term use and consistent grinding performance.
- Grain Size: The grain size of the abrasive is carefully selected based on the desired surface finish and material removal rate. Finer grain sizes are used for achieving a smooth edge surface, while coarser grain sizes may be used for faster material removal during rough grinding.
- Wheel Dimensions: The wheel has specific dimensions, including diameter, thickness, and bore size, to fit the edge grinding equipment. The diameter can range from a few inches to several inches, depending on the wafer size and the grinding machine design.
- Functional Features:
- Precise Edge Shaping: Designed to precisely shape the wafer edge, creating a consistent bevel angle and radius. This ensures that the wafer edges meet the specified geometric requirements, which is important for proper handling and integration into semiconductor packages.
- High Material Removal Rate: Can remove material from the wafer edge at a relatively high rate while maintaining good surface quality. This is achieved through the optimal combination of abrasive material, grain size, and wheel design.
- Long Service Life: Due to the use of high – quality abrasive materials and proper manufacturing processes, the grinding wheel has a long service life, reducing the frequency of wheel changes and downtime in the semiconductor manufacturing line.
- Application Scenarios: Used in semiconductor wafer edge grinding machines in fabs. It is an essential part of the wafer preparation process before further processing steps such as thinning, polishing, and device fabrication.
