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AMAT 0190-35857

Product Name: Thermal Control Subsystem Component
Product Description: A precision electronic or electromechanical component dedicated to temperature sensing, control, or regulation within semiconductor process modules. It is integral to maintaining stable thermal conditions during wafer processing.
Technical Specifications:
  • Operating Environment: Designed for high-vacuum, high-temperature, and corrosive gas environments.

AMAT 0200-18082

Product Name: Ceramic Center Nozzle (1.76L, HDPCVD)
Product Description: A high-purity ceramic nozzle designed for precise gas delivery in HDPCVD (High-Density Plasma Chemical Vapor Deposition) systems.
Technical Specifications:
  • Material: Ultra-high-purity, high-strength ceramic (Alumina or Aluminum Nitride).

AMAT 0190-21303

Product Name: RF Match Cable Assembly (Preclean 2, 0.5M)
Product Description: A specialized high-frequency RF (Radio Frequency) cable assembly designed for connecting RF match networks to process chambers in semiconductor pre-clean systems.
Technical Specifications:
  • Length: 0.5 meters.
  • Connector Type: High-performance, vacuum-compatible RF connectors (TRU-7684).

AMAT 0040-78440

Product Name: CMP Process Component (Titan Head Assembly Part)
Product Description: A precision mechanical component for the Titan Head assembly on Applied Materials' CMP equipment. It is a critical part of the wafer carrier and polishing interface system.
Technical Specifications:
  • Material: High-purity, machined engineering polymer or metal alloy for CMP compatibility.

AMAT 0040-49965

Product Name: 300mm Grooved Retaining Ring (Titan Head)
Product Description: A high-performance retaining ring component for the Titan Head polishing assembly on AMAT Mirra CMP (Chemical Mechanical Planarization) systems. It securely holds the wafer in place during the polishing process.
Technical Specifications:
  • Wafer Size: 300mm (12-inch).

AMAT 0010-21740

Product Name: TC AMP Assembly (Thermocouple Amplifier Assembly)
Product Description: A precision signal conditioning module designed to amplify and process low-level thermocouple signals for accurate temperature measurement within semiconductor process chambers. It is engineered for high signal stability and noise immunity in high-vacuum and high-temperature industrial environments.
Technical Specifications:
  • Compatibility: Optimized for 300mm wafer processing systems.

AMAT 0100-02409

Product Name: High-Density Multi-Channel I/O Interface Circuit Board Assembly
Product Description: This is a high-performance input/output interface circuit board for semiconductor equipment control systems. It serves as a bridge between the main controller and on-site sensors, actuators and execution mechanisms, responsible for signal acquisition, drive output and data interaction.
Technical Specifications:
  • Multi-channel analog input/output: 0–10V, 4–20mA standard signal

AMAT 0051-01848

Product Name: High-Purity Vacuum Exhaust Manifold & Pipeline Fitting Assembly
Product Description: This is a high-purity vacuum exhaust manifold and pipe fitting assembly for semiconductor process equipment, used for the collection, shunting and discharge of process exhaust gas. It ensures smooth gas flow under ultra-high vacuum and resists corrosion of special process gases.
Technical Specifications:
  • Material: 316L stainless steel with electrolytic polishing on inner surface, Ra ≤ 0.4μm

AMAT 0021-21814

Product Name: High-Temperature Thermal Insulation and Shielding Component Assembly
Product Description: This is a thermal management component used in high-temperature semiconductor process chambers, mainly used for thermal insulation, temperature uniformity control and heat source shielding. It is suitable for high-temperature processes such as deposition and annealing to stabilize process temperature field.
Technical Specifications:
  • Main materials: high-purity ceramic, high-temperature composite fiber and special thermal insulation materials

AMAT 0270-90163

Product Name: Ultra-Precision Component Centering and Alignment Fixture Assembly
Product Description: This is a professional precision tooling fixture for semiconductor equipment, used for centering, alignment and positioning assembly of core components in process chambers. It is widely used in equipment assembly, maintenance and upgrading to ensure the positional accuracy of key components.
Technical Specifications:
  • Material: high-strength aluminum alloy with heat stabilization treatment, low thermal deformation

AMAT 0270-20069

Product Name: 8" Wafer Cassette Indexer to Robot Calibration Plate Fixture
Product Description: This is a precision calibration jig used to calibrate the relative position between wafer cassette indexer and automatic handling robot. It provides a unified mechanical reference standard to eliminate positioning deviation, ensuring accurate and stable wafer grabbing and placing actions.
Technical Specifications:
  • Applicable specification: 8-inch (200mm) wafer cassette system

AMAT 0010-77533

Product Name: 200mm MIRRA Titan 1 CMP Polishing Head Assembly
Product Description: This is a special polishing head assembly designed for Applied Materials MIRRA chemical mechanical planarization (CMP) system, specially used for 200mm wafer surface polishing. It realizes uniform pressure application, stable wafer clamping and efficient slurry distribution, ensuring the global and local flatness of wafer surface.
Technical Specifications:
  • Applicable wafer size: 200mm (8-inch) semiconductor wafers