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AMAT 0040-20124 Ceramic Heater Pedestal Assembly

Product Description: A high-performance heating component designed for precise wafer temperature control in semiconductor processing chambers. Features advanced ceramic construction for excellent thermal uniformity and electrical isolation, critical for consistent thin-film deposition results.
Technical Specifications:
  • Wafer Compatibility: 200mm (8-inch) semiconductor wafers
  • Heating Element: Multi-zone embedded resistance heating elements

AMAT 0020-78186 Chamber Liner Shield Assembly

Product Description: A protective component designed to shield critical chamber components from process byproducts and plasma damage in semiconductor etching and deposition systems. Extends chamber maintenance intervals and improves process consistency by containing process contaminants.
Technical Specifications:
  • Material: High-purity 316L stainless steel with yttria coating
  • Coating Thickness: 200μm uniform protective coating

AMAT 3300-07824 Graphite Gasket Seal Assembly

Product Description: A high-temperature sealing component manufactured from premium-grade graphite material, designed for reliable sealing in extreme temperature semiconductor processing applications. Provides excellent thermal stability and chemical resistance in demanding process environments.
Technical Specifications:
  • Material: High-purity flexible graphite foil (99.9% carbon content)
  • Construction: Multi-layer laminated graphite with stainless steel insert

AMAT 0020-21104 Wafer Centering Ring Assembly

Product Description: A precision-machined component designed to accurately center semiconductor wafers within processing chambers, ensuring uniform process results across the entire wafer surface. Critical for maintaining process consistency in both 200mm and 300mm wafer manufacturing environments.
Technical Specifications:
  • Wafer Compatibility: 200mm (8-inch) and 300mm (12-inch) semiconductor wafers
  • Material: High-purity aluminum with hard anodized coating

AMAT 0050-32172 Exhaust Foreline Heater Assembly

Product Description: A temperature-controlled heating assembly designed to prevent process gas condensation and ensure consistent gas flow in semiconductor equipment exhaust systems. Maintains critical exhaust line temperatures to optimize process efficiency and equipment reliability.
Technical Specifications:
  • Heating Element: Mineral-insulated resistance heating element
  • Power Rating: 300W, 240V AC single-phase
  • Temperature Control Range: 80°C to 150°C adjustable setpoint

AMAT 3700-03788 High-Performance O-Ring Seal Assembly

Product Description: A specialized elastomeric seal component designed for critical vacuum and pressure sealing applications in semiconductor processing chambers. Engineered to maintain excellent sealing performance under extreme process conditions while meeting ultra-clean requirements.
Technical Specifications:
  • Material: Chemraz® 513 perfluoroelastomer (FFKM)
  • Durometer: 80 Shore A

AMAT 0021-55107 High-Purity Gas Delivery Nozzle Assembly

Product Description: A precision-engineered gas delivery component designed for uniform distribution of process gases onto semiconductor wafers during thin-film deposition and etching processes. Manufactured with ultra-clean materials to meet the stringent contamination control requirements of advanced semiconductor manufacturing.
Technical Specifications:
  • Material: High-purity 316L stainless steel with electropolished internal surfaces
  • Surface Finish: Ra < 0.4μm for minimal particle entrapment

AMAT 0100-00195 Stepper Motor Interface PCB Assembly

Product Description: A dedicated printed circuit board designed to provide precise control and communication interface for stepper motors in Applied Materials' semiconductor processing equipment. It serves as a critical link between the main system controller and motor drive mechanisms, enabling accurate motion control for wafer handling and chamber positioning systems.
Technical Specifications:
  • Input Voltage: 24V DC nominal, 18–30V DC operating range
  • Power Consumption: Maximum 12W under full load

AMAT 0100-09022 Mini AI/AO PCB Assembly

Product Description: A compact analog input/output printed circuit board designed for precise signal conditioning and conversion in Applied Materials' Precision 5000 series processing systems.
Technical Specifications:
  • Analog Inputs: 8 differential analog input channels (0-10V, 4-20mA)
  • Analog Outputs: 4 analog output channels (0-10V, 4-20mA)

AMAT 0020-04129 Top Hinge Bracket Assembly

Product Description: A structural component designed to support and enable smooth operation of chamber doors in Applied Materials' semiconductor processing equipment.
Technical Specifications:
  • Material: High-strength aerospace-grade aluminum alloy
  • Finish: Hard anodized for corrosion resistance and durability
  • Load Capacity: 50kg maximum door weight support

AMAT 0010-43642 Advanced Gas Distribution Manifold

Product Description: A precision-engineered gas distribution component designed for accurate and uniform delivery of process gases to semiconductor wafers during thin-film deposition and etching processes.
Technical Specifications:
  • Material: High-purity 316L electropolished stainless steel
  • Number of Gas Channels: 6 independent gas delivery channels
  • Flow Control: Integrated precision flow restrictors for uniform distribution

AMAT 0100-09293 Serial Communication PCB Card

Product Description: A high-speed serial communication printed circuit board designed for reliable data transmission between various components in Applied Materials' semiconductor manufacturing systems.
Technical Specifications:
  • Communication Protocol: RS-422/RS-485 serial communication standards
  • Data Transfer Rate: Up to 10Mbps baud rate capability
  • Input Voltage: 24V DC (typical) with wide voltage tolerance (18-30V DC)