Digital guide
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AMAT 0040-78440
Product Name: CMP Process Component (Titan Head Assembly Part)
Product Description: A precision mechanical component for the Titan Head assembly on Applied Materials’ CMP equipment. It is a critical part of the wafer carrier and polishing interface system.
Technical Specifications:
- Material: High-purity, machined engineering polymer or metal alloy for CMP compatibility.
Detailed content
- Tolerances: Ultra-high precision machining for critical alignment and fit.
- Surface Finish: Fine-polished surfaces to minimize particle generation and friction.
Functional Features:
- Ensures precise alignment between the polishing head and wafer.
- Resists degradation from harsh chemical slurries and mechanical abrasion.
- Contributes to stable and repeatable CMP process performance.
Application Scenarios:
- Integrated into Titan Head assemblies for Mirra CMP systems.
- Functions within the wafer polishing interface for dielectric and metal layer planarization.
