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Gasonics AWD-1-7
Product Description: The Gasonics AWD-1-7 is an Automated Wet Decoupling (AWD) system, specifically a single-chamber configuration designed for photoresist stripping and wafer cleaning. It utilizes a combination of chemical baths and plasma ashing techniques to remove organic materials from semiconductor wafers. The “1-7” designation often refers to the chamber configuration and wafer size capability.
Technical Specifications:
- System Type: Single Chamber Automated Wet Decoupling Plasma Stripper
Detailed content
- Wafer Size: Compatible with 150mm (6-inch) to 200mm (8-inch) wafers
- RF Power: 1000W to 3000W adjustable solid-state generator
- Frequency: 13.56 MHz standard
- Process Gases: Oxygen (O2), CF4, Argon, Nitrogen
- Chemicals: Compatible with Piranha solution (H2SO4/H2O2) and SPM
Functional Features:
- Decoupled Plasma: Separates the plasma generation zone from the wafer surface to prevent ion bombardment damage while maintaining high radical density for stripping.
- Automated Handling: Integrated robotic arm for wafer transfer between wet stations and the plasma chamber, reducing manual handling.
- Process Control: Advanced endpoint detection using Optical Emission Spectroscopy (OES) to determine when photoresist is fully removed.
- Temperature Control: Precise control of chemical baths and chuck temperature (typically -20°C to +150°C).
Application Scenarios:
- Photoresist Stripping: Removal of thick photoresist layers after ion implantation or etching.
- Post-Etch Cleaning: Removal of polymer residues from plasma etching processes.
- Ashing: Dry ashing of organic residues prior to wet cleaning.
- Advanced Packaging: Cleaning of substrates for flip-chip and wafer-level packaging processes.
