Digital guide
You are here:
Gasonics AWD-D-1-4–10-002
Product Description: This model represents a specific configuration of the Gasonics AWD-D series, likely a single-chamber or dual-chamber tool optimized for 150mm (6-inch) and specific niche applications. The “10-002” suffix often indicates a specific hardware revision or a configuration with a 10kW power option or specific chamber dimension. It is a high-performance photoresist stripper using downstream plasma technology.
Technical Specifications:
- Chamber Configuration: Single or Dual Downstream Plasma Source
Detailed content
- Wafer Support: Electrostatic Chuck (ESC) or Vacuum Chuck
- RF Power Supply: 1000W – 5000W (depending on specific revision)
- Gas Chemistry: O2/CF4/Ar/N2 mixtures
- Temperature Control: Chilled chuck capability down to -40°C
- Pressure Control: Throttle valve with capacitance manometer for precise pressure control
Functional Features:
- Downstream Design: Plasma is generated remotely and flows downstream to the wafer, preventing UV radiation and ion damage to sensitive device structures.
- Low Damage: Ideal for stripping resist over delicate metal layers or low-k dielectrics.
- High Aspect Ratio Cleaning: Capable of cleaning deep trenches and vias due to the neutral radical nature of downstream plasma.
- Chemical Injection: Capability to inject volatile chemicals (like HMDS) into the plasma stream for enhanced stripping.
Application Scenarios:
- Low-k Dielectric Cleaning: Removal of photoresist without damaging porous low-k materials.
- Copper Metallization: Stripping resist after copper patterning without oxidizing the copper.
- Image Sensor Fabrication: Cleaning of CCD or CMOS image sensors where surface damage is unacceptable.
- RF Device Manufacturing: Processing of GaAs and GaN RF devices.
