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AMAT 0010-29083
Product Name: Endura Cirrus PVD Chamber Liner Kit
Product Introduction: The 0010-29083 is a comprehensive chamber liner and shield kit for the Applied Materials Endura Cirrus PVD system. The Cirrus platform is specialized for Ionized Metal Plasma (IMP) deposition, which is essential for sub-quarter-micron metallization. This kit includes the chamber walls, bottom shields, and target shields that protect the main chamber from sputter coating and plasma erosion. These liners are sacrificial components replaced periodically during preventive maintenance.
Technical Specifications:
- System Compatibility: Applied Materials Endura Cirrus PVD
Detailed content
- Kit Contents: Chamber sidewall liner, bottom shield, target shield, collimator shields
- Material: Aluminum (anodized), Stainless Steel, and Titanium
- Surface Finish: Roughness optimized to minimize arcing
Functional Features: - Particle Trap: The textured or coated surfaces are designed to capture flakes and particles generated during the sputtering process, preventing them from landing on the wafer.
- Thermal Management: High thermal mass helps stabilize chamber temperature during long runs.
- Chemical Compatibility: Resistant to reaction with titanium, tantalum, and copper plasmas.
- Seasoning Support: Designed to be easily “seasoned” (pre-coated) with a thin film of the deposition material to stabilize the sputtering yield before production wafers are processed.
Application Scenarios: - Deposition of barrier layers (TiN, TaN) and copper seed layers.
- Processes requiring extremely low defect densities (killer defect control).
- 300mm wafer processing for advanced logic and memory chips.
- High-volume manufacturing environments where chamber matching and uptime are critical.
