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AMAT 0150-76175
Product Name: Endura Impulse PVD Collimator/Target Assembly Component
Product Introduction: This part number refers to a specific component within the Endura Impulse PVD system, typically associated with the collimator or the target assembly. The Impulse system is designed for Ionized Metal Plasma (IMP) deposition, which provides superior bottom and sidewall coverage compared to traditional sputtering. The collimator is a honeycomb-like structure that filters out neutral atoms, allowing only ionized metal atoms to reach the wafer at a specific angle.
Technical Specifications:
- System Compatibility: Applied Materials Endura Impulse PVD
Detailed content
- Component Type: Collimator or Inner Shield Assembly
- Material: Aluminum or Graphite with specialized coatings (TiN)
- Geometry: Honeycomb structure with high aspect-ratio channels
- Thermal Tolerance: High thermal shock resistance
Functional Features: - Directionality Control: The collimator ensures that deposited atoms arrive perpendicular to the wafer surface, improving bottom coverage in deep vias and trenches.
- Neutral Filtering: Blocks neutral sputtered atoms which do not carry charge and would otherwise deposit randomly on sidewalls, causing overhangs or poor coverage.
- Plasma Shaping: Helps shape the plasma sheath above the wafer, influencing ion bombardment energy.
- Redeposition Control: Shields the chamber walls from deposition, reducing particle sources and extending chamber clean intervals.
Application Scenarios: - Copper seed layer deposition for dual-damascene interconnects.
- Barrier layer deposition (Ta/TaN) in high-aspect-ratio structures.
- Advanced packaging processes like Through-Silicon Vias (TSV) and Flip-Chip bumping.
- Logic devices requiring < 50nm feature sizes where conformal coverage is critical.
