Digital guide

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AMAT 0190-08680

  • Product Introduction:
    This robot arm is a key component in semiconductor wafer handling systems. It is responsible for the precise and rapid transfer of wafers between different process stations within the semiconductor manufacturing equipment, such as from load locks to process chambers and vice versa. Its high – speed and high – precision operation are essential for improving the overall throughput and yield of the manufacturing process.
  • Technical Specifications:
    • Material: The main structure is made of lightweight and high – strength carbon fiber composite material, which reduces the inertia of the arm and enables faster acceleration and deceleration.

Detailed content

    • The end – effector, which comes in direct contact with the wafer, is made of a non – contaminating material such as polyether ether ketone (PEEK) to prevent any damage or contamination to the wafer surface.
    • Degrees of Freedom: It has six degrees of freedom, including three linear motions (X, Y, and Z axes) and three rotational motions (pitch, yaw, and roll). This allows for flexible and precise positioning of the wafer in three – dimensional space.
    • Motion Range: The X – axis has a motion range of 500 mm, the Y – axis has a motion range of 400 mm, and the Z – axis has a motion range of 300 mm. The rotational ranges are ±90° for pitch and yaw and ±180° for roll.
    • Speed and Accuracy: The maximum linear speed is 1 m/s, and the maximum rotational speed is 180°/s. The positioning accuracy is ±0.05 mm for linear motions and ±0.05° for rotational motions.
  • Functional Features:
    • Wafer Gripper: The end – effector is equipped with a vacuum – based wafer gripper that can securely hold wafers of different sizes (e.g., 200 mm and 300 mm) without causing any damage. The vacuum level can be precisely controlled to ensure reliable gripping and release.
    • Collision Detection: It has built – in collision detection sensors that can detect any obstacles during the arm’s motion. In case of a potential collision, the arm will automatically stop to prevent damage to the wafer, the arm itself, or other equipment.
    • Software Control: The robot arm is controlled by advanced software that allows for programmable motion sequences. This enables it to adapt to different manufacturing processes and handle wafers in a customized manner.
  • Application Scenarios:
    • Automated Wafer Transfer Systems: In semiconductor fabrication facilities, it is used to transfer wafers between different process tools, such as photolithography machines, etchers, and deposition equipment, in a fully automated manner.
    • Cleanroom Environments: Its design and materials make it suitable for use in cleanroom environments where strict contamination control is required. The non – contaminating end – effector and the sealed structure prevent the generation and spread of particles.

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