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AMAT 0150-34781
- Product Introduction:
This component is a critical part of advanced semiconductor manufacturing equipment, specifically designed to operate within the high – precision and high – reliability requirements of the semiconductor production environment. It serves as a key element in ensuring the smooth and accurate execution of various manufacturing processes, such as etching, deposition, and lithography. - Technical Specifications:
- Material: Constructed from a proprietary high – purity ceramic – metal composite material. This material offers excellent thermal stability
Detailed content
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- with a coefficient of thermal expansion (CTE) closely matched to other components in the system, minimizing thermal – induced stresses.
- Dimensions: The overall length is 150 ± 0.05 mm, width is 50 ± 0.03 mm, and height is 20 ± 0.02 mm. The surface roughness is less than Ra 0.1 μm, ensuring a smooth surface for optimal performance.
- Electrical Properties: It has a high electrical resistivity of over 10^12 Ω·cm, preventing electrical interference in the semiconductor manufacturing process.
- Functional Features:
- High – Precision Positioning: Equipped with a micro – adjustment mechanism that allows for precise positioning with an accuracy of up to ±0.1 μm. This is crucial for aligning the component with other parts of the manufacturing equipment during complex processes.
- Thermal Management: The internal structure is designed with thermal channels that facilitate efficient heat dissipation. This helps in maintaining a stable operating temperature, even during long – duration and high – power manufacturing operations.
- Corrosion Resistance: The surface is treated with a special coating that provides excellent resistance to chemical corrosion from various process gases and liquids used in semiconductor manufacturing, such as hydrofluoric acid and chlorine – based compounds.
- Application Scenarios:
- Lithography Machines: In extreme ultraviolet (EUV) lithography systems, it is used to position the mask and wafer accurately, ensuring the high – resolution transfer of circuit patterns onto the wafer.
- Etching Equipment: It helps in controlling the position of the etching head relative to the wafer, enabling precise removal of material to create the desired circuit features.
