Digital guide
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AMAT 0021-85102
Product Name: Endura Vacuum Robot Blade
Product Introduction: A critical handling component used within the vacuum transfer modules of Endura cluster tools. It is the specific end-effector that physically contacts the semiconductor wafer to move it between process stations.
Technical Specifications:
- Material: Carbon fiber reinforced PEEK or Ceramic for low particle generation.
- Dimensions: Custom geometry to fit specific wafer sizes (200mm or 300mm).
Detailed content
- Thickness: Ultra-thin profile (typically 2-3mm) to minimize gap with wafer backside.
- Thermal Expansion: Low CTE (Coefficient of Thermal Expansion) to maintain dimensional stability.
- Lifetime: Rated for 50,000 to 100,000 wafer transfers.
Functional Features: - Low Particle Generation: Surface is polished and coated to prevent scratching wafers.
- Vacuum Grooves: Incorporates micro-channels for Bernoulli or vacuum chucking to hold the wafer securely during transport.
- Alignment Keys: Precision-machined edges to ensure repeatable wafer orientation (flat/notch alignment).
- Sensor Integration: Capable of housing proximity sensors to confirm wafer presence.
Application Scenarios: - Cluster Tool Integration: Used in the central vacuum robot of Endura PVD, CVD, and Etch systems.
- Load Lock Transfer: Moves wafers from atmospheric load locks into the vacuum processing environment.
- Multi-Chamber Handling: Transports wafers sequentially through different process modules without breaking vacuum.
