Digital guide
You are here:
AMAT 0020-19002
Product Name: Process Chamber Liner (Chamber Shield)
Product Introduction: A consumable protective shield installed on the inner walls of a vacuum process chamber. It protects the expensive main chamber body from plasma erosion, deposition, and chemical corrosion.
Technical Specifications:
- Material: Aluminum, Aluminum Nitride (AlN), or Silicon Carbide (SiC) depending on process severity.
- Coating: Yttrium (Y) or Yttria-Alumina for plasma spray resistance.
- Thickness: 5mm to 20mm.
Detailed content
- Surface Finish: Ra < 1.6 micrometers to prevent particle accumulation.
- Temperature Rating: Up to 600°C for high-temperature processes.
Functional Features: - Erosion Resistance: Sacrificial layer that absorbs ion bombardment, extending the life of the chamber.
- Gettering: Acts as a getter to trap impurities and oxygen, improving process purity.
- Grounding Path: Provides a controlled electrical ground path for plasma potential.
- Easy Replacement: Designed as a consumable part for periodic preventive maintenance (PM).
Application Scenarios: - PVD Chambers: Protects against target material sputter deposition and high-energy ion reflection.
- Etch Chambers: Shields against highly corrosive by-products (e.g., metal chlorides).
- CVD Chambers: Prevents unwanted nucleation on chamber walls, reducing particle fallout.
