Digital guide
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AMAT 0020-21755
Product Name: Focus Ring Assembly
Product Introduction: A component placed around the perimeter of the wafer on the pedestal. It confines the plasma to the wafer area and protects the edge of the wafer and the chamber from deposition/etch.
Technical Specifications:
- Material: Silicon, Silicon Carbide, or Quartz.
- Inner Diameter: Matches wafer diameter (e.g., 300mm) with a tight tolerance (±0.1mm).
Detailed content
- Outer Diameter: Matches the pedestal diameter.
- Height: 5mm to 15mm.
- Hardness: High hardness to resist plasma erosion (e.g., > 15 GPa for SiC).
Functional Features: - Plasma Confinement: Shapes the plasma sheath to ensure uniform processing at the wafer edge.
- Edge Protection: Prevents “edge roll-off” in deposition and protects the wafer bevel from etching.
- Gas Sealing: Creates a seal to control the flow of process gases over the wafer surface.
- Replaceable: Designed as a consumable part with a shorter life than the main pedestal.
Application Scenarios: - Etch Processes: Critical for maintaining critical dimension (CD) uniformity at the wafer edge.
- PVD Sputtering: Controls the thickness profile near the wafer edge (edge exclusion).
- High-Density Plasma Sources: Used in ICP chambers to define the plasma boundary.
