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AMAT 0190-14783

Product Name: RF Match Network Control Module
Product Description: An intelligent electronic control module that manages the automatic tuning of an RF impedance matching network for plasma processes.
Technical Specifications:
  • RF Frequency: 13.56 MHz (standard)

AMAT 0200-09432

Product Name: Plasma Tube Applicator, PRSP3, 25mm
Product Description: A precision-fabricated quartz plasma tube assembly designed to generate and contain remote plasma for in-situ chamber cleaning and pre-treatment processes.
Technical Specifications:
  • Material: High-purity fused quartz

AMAT 0200-03170

Product Name: Quartz Focus Ring / Gas Baffle
Product Description: A high-purity quartz ring engineered to optimize gas flow dynamics and focus plasma distribution uniformly over the wafer surface during semiconductor processing.
Technical Specifications:
  • Material: High-purity synthetic fused silica (quartz)

AMAT 0200-02107

Product Name: Ceramic Lift Pin Assembly
Product Description: A precision-machined ceramic component designed to lift and position wafers within semiconductor process chambers without causing contamination or damage.
Technical Specifications:
  • Material: High-purity alumina (Al₂O₃) ceramic, 99.6% purity

AMAT 0190-36109

Product Name: IPS Lamps Driver Assembly, 3-Zone, 5200
Product Description: A dedicated electronic driver module for controlling and powering the 3-zone infrared lamp array in the Integrated Plasma Source (IPS) of semiconductor processing systems.
Technical Specifications:
  • Zones: 3 independent controllable heating zones

AMAT 0050-07527

Product Name: Ultra-High Purity (UHP) Gas Filter Assembly
Product Description: A compact, high-efficiency gas purification filter designed to remove particulates and contaminants from ultra-high purity process gases in semiconductor gas delivery lines.
Technical Specifications:
  • Filter Type: Multi-stage sintered metal media filter

AMAT 0100-35057

Product Name: Mainframe Interlock Monitoring PCB Assembly
Product Description: A printed circuit board (PCB) that monitors and controls safety interlock switches throughout the semiconductor tool mainframe and process modules.
Technical Specifications:
  • Type: Multi-channel digital input/output (DIO) interlock board

AMAT 0020-34587

Product Name: Chamber Liner Shield
Product Description: A one-piece, formed quartz or ceramic liner designed to line the interior walls of a process chamber, protecting them from coating and plasma damage.
Technical Specifications:
  • Material: High-purity fused quartz or sintered alumina ceramic

AMAT 0020-29342

Product Name: High-Temperature Ceramic Insulator Ring
Product Description: A robust ceramic ring providing electrical isolation and thermal stability for high-voltage and RF components within semiconductor process chambers.
Technical Specifications:
  • Material: High-purity boron nitride (BN) ceramic composite

AMAT 3320-01165

Product Name: PCII Adapter Alignment Bushing
Product Description: A precision-machined structural component designed for aligning and securing the PCII (Pressure Control Interface) adapter within 300mm semiconductor process chambers.
Technical Specifications:
  • Material: 316L stainless steel, passivated surface

AMAT 0020-70459

Product Name: Quartz Gas Distribution Plate
Product Description: A precision-fabricated quartz plate featuring a matrix of micro-drilled holes for uniform distribution of process gases across a wafer surface in semiconductor deposition chambers.
Technical Specifications:
  • Material: High-purity synthetic fused silica (quartz)

AMAT 0040-88716

Product Name: Electrostatic Chuck (ESC) Heater Assembly
Product Description: A precision heating element integrated with an electrostatic chuck (ESC) for maintaining uniform wafer temperature during high-vacuum semiconductor processes.
Technical Specifications:
  • Heating Type: Resistive thin-film heater, dual-zone temperature control