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AMAT 0020-26313

Product Name: 50 Ohm Coaxial RF Power Cable Assembly Product Introduction: This is a high-power transmission line assembly designed to carry RF energy from the matching network or generator to the plasma coil or electrode within the process chamber. It must handle high voltages and currents while minimizing signal loss (attenuation) and reflection. The cable is engineered for flexibility to accommodate moving parts (like lift pins) while maintaining electrical integrity in a harsh environment with RF fields and magnetic interference. Technical Specifications:

  • Impedance: 50 Ohms (Nominal), strictly controlled to maintain VSWR < 1.2:1

AMAT 0040-62681

Product Name: Helium-Neon (HeNe) Reference Laser Interferometer Product Introduction: This is a precision optical metrology component used for alignment and distance measurement within semiconductor tools. The HeNe laser generates a coherent red beam (632.8 nm) with exceptional stability. It is used in interferometry systems to measure wafer position, focus height, and robot arm positioning with sub-micron accuracy. The unit typically includes the laser tube, power supply, optics (mirrors, beam splitters), and detectors. It ensures that the wafer is positioned exactly at the focal point of the processing optics or within the plasma sheath.

AMAT 0010-53873

Product Name: High-Vacuum Pneumatic Gate Valve Product Introduction: This is a critical isolation valve used in vacuum processing systems to separate the process chamber from the vacuum pump stack or transfer modules. It utilizes a pneumatic actuator to open and close a gate or butterfly valve mechanism. The design focuses on minimal outgassing, high conductance (to allow fast pumping), and the ability to hold a high vacuum (10-7 to 10-9 Torr) when closed. It is a key component for maintaining process integrity and enabling maintenance without breaking the vacuum in adjacent chambers.

AMAT 0020-28158

Product Name: High-Precision Digital Mass Flow Controller (MFC) Product Introduction: This device is a critical component of the Gas Delivery System (GDS) in semiconductor manufacturing equipment.114. It is designed to measure and control the flow of process gases with extremely high accuracy and repeatability. The MFC uses thermal mass flow sensing technology to measure the flow rate and a proportional control valve to regulate it. This specific unit is engineered for corrosive and non-corrosive gases, ensuring that the precise stoichiometry required for thin-film deposition and etching is maintained. It features digital communication for real-time monitoring and closed-loop control.

AMAT 0140-12305

Product Name: Single-Crystal Silicon Carbide (SiC) Wafer Clamping Ring Product Introduction: This is a high-precision consumable component used in conjunction with Electrostatic Chucks (ESC) to secure the wafer during high-temperature processing. Unlike standard aluminum or anodized aluminum rings, this component is fabricated from single-crystal Silicon Carbide (SiC), a material chosen for its exceptional hardness, high thermal conductivity, and chemical inertness. It prevents wafer slippage, ensures uniform heat transfer from the chuck to the wafer, and defines the "edge exclusion" zone where no film is deposited, which is critical for subsequent lithography and CMP steps.

AMAT 0150-14869

Product Name: Chamber Liner and Shield Kit for PVD Impulse Systems Product Introduction: This is a comprehensive consumable kit designed for the Applied Materials Impulse PVD platform, serving as the primary sacrificial barrier protecting the stainless steel chamber walls from physical sputtering, chemical corrosion, and thermal stress. The kit typically includes the main chamber liner, collimator shields, and dark space shields. By absorbing the deposition and preventing material flaking, it ensures particle-free processing and maintains the vacuum integrity of the system. The material selection and surface engineering are optimized to reduce particle generation and extend the mean time between preventive maintenance (PM).

AMAT 0200-20055

Product Name: RF Impedance Matching Network Assembly for Endura PVD Systems Product Introduction: This component is a sophisticated RF matching network specifically engineered for the Applied Materials Endura series of Physical Vapor Deposition (PVD) tools. It acts as the critical interface between the RF power generator and the plasma processing chamber. Its primary function is to ensure maximum power transfer efficiency by dynamically adjusting the impedance to match the complex load presented by the plasma, which fluctuates significantly during ignition, steady-state processing, and plasma extinction. This unit is essential for maintaining process stability, minimizing reflected power that can damage expensive generators, and ensuring film uniformity across the wafer surface.

AMAT 0140-12305

Product Name: Wafer Clamping Ring Assembly Product Introduction: A precision-machined component used to secure the wafer firmly against the electrostatic chuck (ESC) during high-temperature and high-stress processing. It ensures excellent thermal transfer and prevents wafer edge lifting during plasma bombardment. Technical Specifications:

  • Material: Single-crystal Silicon Carbide (SiC) or Yttrium-coated Aluminum
  • Diameter: Configured for 200mm (300mm equivalent available) standard wafer sizes

AMAT 0150-14869

Product Name: Chamber Liner Kit for PVD Impulse Systems Product Introduction: This is a consumable chamber liner kit specifically engineered for the Impulse PVD platform. It acts as a sacrificial shield to protect the main chamber walls from sputtering deposition, particle generation, and chemical corrosion during the physical vapor deposition process. Technical Specifications:

  • Material: High-purity Aluminum (Al) or Aluminum-Magnesium alloy (for specific barrier layers)
  • Dimensions: Custom fit for 200mm and 300mm wafer processing chambers

AMAT 0200-20055

Product Name: Advanced RF Match Network Assembly for Endura Platforms Product Introduction: This component is a critical RF matching network designed for Applied Materials' Endura series physical vapor deposition (PVD) systems. It serves to maximize power transfer between the RF generator and the plasma chamber, ensuring stable plasma ignition and maintenance during high-power sputtering processes. Technical Specifications:

  • Frequency Range: 13.56 MHz (Standard Industrial Band)

AMAT 0040-01239

Product Name: Electrostatic Chuck (ESC) for Etch/Deposition Systems Product Introduction: The 0040-01239 is an Electrostatic Chuck (ESC) assembly used in various Applied Materials process modules (both etch and deposition). The ESC is the platform on which the wafer sits inside the vacuum chamber. It uses electrostatic force (Coulomb or Johnsen-Rahbek effect) to hold the wafer firmly in place, even under high vacuum and during plasma bombardment. It also typically incorporates a helium backside cooling system to control wafer temperature. Technical Specifications:

  • System Compatibility: Multi-chamber platforms (e.g., DPS, Eterna)

AMAT 0010-10901

Product Name: 300mm Endura Volta HD+ PVD Chamber Component Kit (Collimator/Shield) Product Introduction: This kit is a major maintenance hardware set for the Applied Materials Endura Volta HD+ PVD system. It is designed to refresh the internal chamber environment to "like-new" condition. The Volta HD+ is a high-density plasma source used for filling small features with copper. The kit typically includes the collimator, chamber liners, and various shields that have been eroded by the intense plasma bombardment over thousands of wafers. Technical Specifications:

  • System Compatibility: Endura Volta HD+ (300mm)