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AMAT 0010-09093 Wafer Chuck Heater Assembly

Product Description: A high-performance heating assembly designed for precise wafer temperature control in semiconductor processing chambers, providing uniform heating across the entire wafer surface.
Technical Specifications:
  • Wafer Compatibility: 150mm (6-inch) and 200mm (8-inch) semiconductor wafers
  • Temperature Range: Ambient to 450°C operational range

AMAT B804950-47 Precision RF Matching Network Component

Product Description: A critical RF (Radio Frequency) matching network component designed for impedance matching in plasma-based semiconductor processing equipment, ensuring efficient power transfer to process chambers.
Technical Specifications:
  • Frequency Range: 400kHz to 13.56MHz standard RF process frequencies
  • Power Handling: 5kW continuous, 10kW peak power capability

AMAT T1102-01-290-1 High-Precision Temperature Sensor Assembly

Product Description: A specialized temperature measurement component designed for extreme environment monitoring in semiconductor processing equipment, offering exceptional accuracy and stability.
Technical Specifications:
  • Sensor Type: Platinum RTD (Resistance Temperature Detector) with Class A accuracy
  • Temperature Range: -200°C to +850°C operational range

AMAT 0100-02292 Advanced Process Control Module

Product Description: A high-performance control module designed for precise regulation of semiconductor manufacturing processes, serving as a critical component in Applied Materials' advanced processing systems.
Technical Specifications:
  • Input Voltage: 24V DC (redundant power input capability)
  • Power Consumption: Maximum 8.5W under full operational load

AMAT 0041-34893 300mm Dual Delivery Faceplate

Product Description: A precision-engineered faceplate component designed for Applied Materials' Producer series semiconductor processing systems, specifically engineered for dual gas delivery applications in 300mm wafer processing environments.
Technical Specifications:
  • Wafer Compatibility: 300mm (12-inch) semiconductor wafers
  • System Compatibility: Applied Materials Producer series CVD/PVD chambers

AMAT 0190-01947 Process Gas Distribution Manifold

Product Introduction: This is a centralized high-purity gas distribution manifold for semiconductor process equipment, used for multi-path gas collection, distribution, mixing and switching. It provides a clean, low-particle, ultra-low leakage gas pipeline integration scheme, realizing centralized management and stable supply of process gas, and improving the safety and maintainability of the gas system.
Technical Specifications:
  • Interface: 12 VCR ports, including 6 inlets and 6 outlets
  • Material: 316L electropolished stainless steel

AMAT 0190-00318 Turbo Pump Controller Module

Product Introduction: This is a special digital controller for turbo molecular pump, which is used to drive, control and protect the turbo pump in semiconductor vacuum system. It can realize the stable operation of the turbo pump from start-up to high-speed rotation, monitor the working state in real time, ensure the safe and reliable acquisition of high vacuum, and is the core control component of the semiconductor vacuum system.
Technical Specifications:
  • Applicable Pump: AMAT Turbo-V® 700/1000 series turbo molecular pump
  • Speed Control Range: 0–72,000 RPM stepless adjustment

AMAT 0150-28295 Wafer Chuck Assembly (Electrostatic)

Product Introduction: This is an electrostatic chuck (ESC) for wafer clamping and temperature control in semiconductor plasma process. It uses electrostatic force to fix the wafer without mechanical pressure, realizing uniform support, efficient heat transfer and precise temperature control of the wafer, which is crucial for ensuring process uniformity, film quality and wafer flatness.
Technical Specifications:
  • Applicable Wafer: 300mm silicon wafer
  • Clamping Voltage: 500–2000 VDC adjustable

AMAT 0150-25963 Digital Mass Flow Controller (MFC)

Product Introduction: This is a high-performance digital mass flow controller for semiconductor process equipment, which can realize high-precision measurement and control of gas flow. It adopts advanced digital signal processing and multi-gas calibration technology, with high accuracy, fast response and good stability, and is widely used in various gas supply links that require precise flow control.
Technical Specifications:
  • Flow Range: 1 sccm–1000 sccm, multiple ranges are available

AMAT 0100-91086 Plasma Chamber Liner Assembly

Product Introduction: This is a high-performance plasma-resistant ceramic lining component used in the plasma process chamber. It can protect the chamber wall from plasma erosion, prevent metal pollution and particle shedding, maintain the cleanliness of the process environment, extend the maintenance period of the equipment, and is a key consumable to ensure the stability of the etching and deposition process and the yield of wafers.
Technical Specifications:
  • Main Material: 99.9% high-purity alumina (Al₂O₃) ceramic

AMAT 0100-35346 Chamber Pressure Control Valve

Product Introduction: This is a high-precision vacuum pressure regulating valve specially used for semiconductor process chambers. It can realize stable and accurate pressure control from high vacuum to atmospheric pressure, and is widely used in the pressure regulation of etching, deposition, cleaning and other process chambers. Its ultra-low leakage, fast response and high stability ensure the process repeatability and wafer consistency.
Technical Specifications:
  • Pressure Control Range: 10⁻⁶ Torr to 760 Torr, covering full vacuum to atmospheric pressure
  • Control Accuracy: ±0.1% of set value, with high precision regulation ability

AMAT 0040-89644 RF Match Network Assembly

Product Introduction: This is a high-performance automatic radio frequency impedance matching network for plasma process equipment. It can automatically adjust the impedance between the RF power supply and the plasma load in real time, minimize the reflected power, maximize the energy transfer efficiency, ensure the stable ignition and uniform distribution of plasma, and directly affect the process uniformity, repeatability and equipment stability of etching and deposition.
Technical Specifications:
  • Working Frequency: 13.56 MHz standard industrial RF frequency