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AMAT 0021-07905

Product Name: High‑Voltage Ceramic Insulator Spacer
Product Description: A precision‑machined ceramic component used to electrically isolate and physically support electrodes, chucks, and chamber components in high‑voltage plasma environments.
Technical Specifications:
  • Material: High-purity alumina ceramic (Al₂O₃), ≥99.6% purity

AMAT 0010-09652

Product Name: Wafer Indexer Control PCB Assembly
Product Description: A dedicated control board that manages the motion, positioning, and synchronization of wafer indexer mechanisms in multi‑chamber semiconductor platforms.
Technical Specifications:
  • Processor: 32-bit high-speed embedded controller

AMAT 0021-13217

Product Name: Plasma‑Resistant Chamber Shield Assembly
Product Description: A consumable shield assembly that lines the inner chamber wall to capture sputtered materials, confine plasma, and protect the main chamber body from damage.
Technical Specifications:
  • Material: High-purity aluminum with anodized or ceramic coating

AMAT 0040-09095

Product Name: High-Purity Quartz Gas Distribution Insert
Product Description: A fused silica component designed to uniformly distribute process gases inside semiconductor chambers while maintaining chemical inertness and high purity.
Technical Specifications:
  • Material: High-purity synthetic fused quartz (SiO₂), ≥99.99% purity

AMAT 0100-01652

Product Name: Closed-Loop Motor Driver PCB Assembly
Product Description: A control circuit board that drives and regulates precision motors used in wafer handling, valve actuation, and chamber adjustment mechanisms.
Technical Specifications:
  • Input Voltage: 24V DC

AMAT 0040-34815

Product Name: High-Temperature Electrostatic Chuck Cover Ring
Product Description: A precision-machined component installed around the electrostatic chuck (ESC) to protect the ESC edge, stabilize plasma distribution, and improve wafer temperature uniformity.
Technical Specifications:
  • Material: High-purity ceramic or high-performance polymer composite

AMAT 0190-41186

Product Name: RF Match Network Tuning Drive Assembly
Product Description: A precision electromechanical drive unit that automatically adjusts the positions of variable capacitors in RF impedance matching networks to maintain optimal power transfer to plasma loads.
Technical Specifications:
  • Motor Type: High-precision stepper motor with encoder feedback

AMAT 0140-00031

Product Name: High-Voltage Power Interconnect Cable Assembly
Product Description: A heavy-duty power cable assembly engineered for stable power transmission in high-power sections of semiconductor processing equipment, with strong anti-interference performance.
Technical Specifications:
  • Conductor: High-purity multi-strand tinned copper wire

AMAT 0040-45062

Product Name: Chamber Liner with Integrated Gas Channel
Product Description: A precision‑formed chamber liner designed for semiconductor process chambers, featuring built‑in gas channels to deliver process gases evenly while protecting the chamber body from plasma and deposition byproducts.
Technical Specifications:
  • Material: High-purity aluminum alloy with ceramic plasma-resistant coating

AMAT 5000-158

Product Name: High-Performance Relay Module
Product Description: A industrial-grade signal and power control relay module used in semiconductor equipment control systems to switch loads, isolate circuits and execute safety interlock logic reliably.
Technical Specifications:
  • Contact Rating: 5A at 250V AC / 30V DC

AMAT 0050-09387

Product Name: Gas Injection Nozzle Assembly
Product Description: A precision flow control component used to inject process gases into reaction chambers in a controlled and uniform manner, ensuring stable gas distribution and consistent process results.
Technical Specifications:
  • Material: 316L stainless steel or high-purity quartz

AMAT 0020-22479

Product Name: Plasma Chamber Shield Assembly
Product Description: A consumable metal shield assembly installed inside process chambers to capture sputtered particles, confine plasma and protect the main chamber body from direct plasma erosion and deposition accumulation.
Technical Specifications:
  • Material: High-purity aluminum or titanium alloy with anti-sputtering coating