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AMAT 8045R2-1

Product Name: Robot Teach Pendant Handheld Controller
Product Introduction: A handheld teach pendant controller for semiconductor wafer handling robots, providing manual control, programming, and diagnostic capabilities for AMAT 300mm wafer processing equipment.
Technical Specifications:
  • Display: High-brightness LCD screen for clear readout in cleanroom environments

AMAT 0020-48628

Product Name: Grounded Lift Pin Assembly
Product Introduction: A precision-engineered grounded lift pin assembly for 300mm wafer semiconductor process chambers, enabling safe, stable, and electrically grounded wafer lifting and positioning.
Technical Specifications:
  • Wafer Compatibility: 300mm (12-inch) wafer processing systems

AMAT 0040-32460

Product Name: Process Chamber Flange Component
Product Introduction: A precision-machined flange component for semiconductor process chambers, ensuring vacuum integrity and structural stability in high-vacuum manufacturing environments.
Technical Specifications:
  • Material: 316L stainless steel for corrosion resistance and vacuum compatibility

AMAT 055-03-903-010

Product Name: High-Purity Heater Assembly
Product Introduction: A specialized heater assembly designed for semiconductor process chambers, providing uniform and stable thermal control for wafer processing environments.
Technical Specifications:
  • Material: High-purity aluminum nitride (AlN) or ceramic composite

AMAT 0190-21320

Product Name: High-Precision Servo Drive Module
Product Introduction: A dedicated servo drive module engineered for precise motion control in semiconductor manufacturing equipment, delivering high-performance actuation for wafer handling and positioning subsystems.
Technical Specifications:
  • Input Voltage: 24–48V DC industrial power supply

AMAT 0150-00099

Product Name: Precision Sensor/Transducer Module
Product Introduction: A high-precision sensor or transducer module designed for monitoring critical process parameters in semiconductor manufacturing equipment.
Technical Specifications:
  • Sensing Type: Optimized for specific parameter measurement (pressure, temperature, flow)

AMAT 0041-14901

Product Name: High‑Performance RF/Plasma Component
Product Introduction: A specialized RF or plasma-related component designed for high-frequency applications in semiconductor plasma-enhanced deposition and etching processes.
Technical Specifications:
  • Material: High-purity ceramic, quartz, or metal alloy for RF compatibility

AMAT AS01391-21-1

Product Name: CDN391R VME DeviceNet Digital I/O PCB Card
Product Introduction: A high-performance VME-bus digital I/O PCB card with DeviceNet communication capability, designed for industrial automation and process control in semiconductor manufacturing equipment.
Technical Specifications:
  • Bus Interface: Standard VME bus protocol for system integration

AMAT 0090-00494

Product Name: Precision Mechanical Component/Assembly
Product Introduction: A high-precision mechanical component or assembly designed for critical motion and positioning functions in semiconductor manufacturing equipment.
Technical Specifications:
  • Material: High-grade stainless steel, aluminum, or engineered polymer

AMAT 3700-01615

Product Name: Brown Viton O‑Ring Seal
Product Introduction: A high-performance O‑ring seal made from brown Viton material, designed for vacuum and gas delivery systems in semiconductor manufacturing equipment.
Technical Specifications:
  • Material: Brown Viton (fluoroelastomer) for chemical resistance

AMAT 0200-02576

Product Name: 200mm Fixed Lift Pin Lift Ring Assembly
Product Introduction: A precision lift ring assembly with fixed lift pins, designed for 200mm wafer semiconductor process chambers to enable safe and precise wafer lifting and positioning.
Technical Specifications:
  • Wafer Size Compatibility: 200mm (8-inch) wafer processing systems

AMAT 0040-46602

Product Name: Process Chamber Structural Component
Product Introduction: A critical structural component for semiconductor process chambers, providing mechanical support and maintaining vacuum integrity in thin-film deposition and etching systems.
Technical Specifications:
  • Material: High-grade aluminum alloy or stainless steel for structural rigidity