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AMAT 0021-21984

Product Name: Ceramic Insulator / Isolation Ring
Product Description: A high-purity ceramic component designed for electrical isolation and structural support within semiconductor process chambers. It insulates powered electrodes from grounded chamber components while maintaining mechanical stability.
Technical Specifications:
  • Material: High-purity alumina (Al₂O₃) ceramic, offering exceptional dielectric strength.

AMAT 0010-70321

Product Name: Slit Valve Actuator / Door Assembly
Product Description: A complete electromechanical actuator assembly for operating slit valves or chamber doors in semiconductor vacuum systems. It provides reliable, repeatable motion for isolating process chambers during wafer transfer.
Technical Specifications:
  • Actuator Type: Pneumatic or servo-electric drive for precise positioning.

AMAT 0010-78170

Product Name: Integrated Circuit Board Assembly / Control Module
Product Description: A complex printed circuit board assembly (PCBA) that functions as a control, interface, or processing module within the semiconductor tool's electronic system. It manages I/O signals, communication, or subsystem control.
Technical Specifications:
  • Form Factor: Standard VME, cPCI, or proprietary AMAT backplane compatible.

AMAT 0200-35595

Product Name: Precision Process Ring/Insulator
Product Description: A high-performance ceramic or quartz component used as a ring, shield, or insulator within semiconductor process chambers. It provides electrical isolation, thermal stability, and protection against process byproducts.
Technical Specifications:
  • Material: High-purity quartz (fused silica) or advanced technical ceramic.

AMAT 3700-02322

Product Name: High-Performance O-Ring Seal
Product Description: A precision-molded elastomeric seal (O-Ring) for critical vacuum and fluid interfaces in semiconductor manufacturing equipment. It is designed for extreme reliability in harsh process conditions.
Technical Specifications:
  • Material: High-grade fluoroelastomer (e.g., Chemraz, Kalrez, or Viton) for extreme chemical resistance.

AMAT 0190-35857

Product Name: Thermal Control Subsystem Component
Product Description: A precision electronic or electromechanical component dedicated to temperature sensing, control, or regulation within semiconductor process modules. It is integral to maintaining stable thermal conditions during wafer processing.
Technical Specifications:
  • Operating Environment: Designed for high-vacuum, high-temperature, and corrosive gas environments.

AMAT 0200-18082

Product Name: Ceramic Center Nozzle (1.76L, HDPCVD)
Product Description: A high-purity ceramic nozzle designed for precise gas delivery in HDPCVD (High-Density Plasma Chemical Vapor Deposition) systems.
Technical Specifications:
  • Material: Ultra-high-purity, high-strength ceramic (Alumina or Aluminum Nitride).

AMAT 0190-21303

Product Name: RF Match Cable Assembly (Preclean 2, 0.5M)
Product Description: A specialized high-frequency RF (Radio Frequency) cable assembly designed for connecting RF match networks to process chambers in semiconductor pre-clean systems.
Technical Specifications:
  • Length: 0.5 meters.
  • Connector Type: High-performance, vacuum-compatible RF connectors (TRU-7684).

AMAT 0040-78440

Product Name: CMP Process Component (Titan Head Assembly Part)
Product Description: A precision mechanical component for the Titan Head assembly on Applied Materials' CMP equipment. It is a critical part of the wafer carrier and polishing interface system.
Technical Specifications:
  • Material: High-purity, machined engineering polymer or metal alloy for CMP compatibility.

AMAT 0040-49965

Product Name: 300mm Grooved Retaining Ring (Titan Head)
Product Description: A high-performance retaining ring component for the Titan Head polishing assembly on AMAT Mirra CMP (Chemical Mechanical Planarization) systems. It securely holds the wafer in place during the polishing process.
Technical Specifications:
  • Wafer Size: 300mm (12-inch).

AMAT 0010-21740

Product Name: TC AMP Assembly (Thermocouple Amplifier Assembly)
Product Description: A precision signal conditioning module designed to amplify and process low-level thermocouple signals for accurate temperature measurement within semiconductor process chambers. It is engineered for high signal stability and noise immunity in high-vacuum and high-temperature industrial environments.
Technical Specifications:
  • Compatibility: Optimized for 300mm wafer processing systems.

AMAT 0100-02409

Product Name: High-Density Multi-Channel I/O Interface Circuit Board Assembly
Product Description: This is a high-performance input/output interface circuit board for semiconductor equipment control systems. It serves as a bridge between the main controller and on-site sensors, actuators and execution mechanisms, responsible for signal acquisition, drive output and data interaction.
Technical Specifications:
  • Multi-channel analog input/output: 0–10V, 4–20mA standard signal