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AMAT 0040-49965
Product Name: 300mm Grooved Retaining Ring (Titan Head)
Product Description: A high-performance retaining ring component for the Titan Head polishing assembly on AMAT Mirra CMP (Chemical Mechanical Planarization) systems. It securely holds the wafer in place during the polishing process.
Technical Specifications:
- Wafer Size: 300mm (12-inch).
Detailed content
- Material: Engineered composite PPS (Polyphenylene Sulfide) AEP material.
- Design: Features precision-machined grooves for optimal slurry distribution and retention.
- Dimensions: Precision-machined to exacting tolerances for perfect fit with Titan Head assemblies.
Functional Features:
- Exceptional wear resistance and chemical compatibility with CMP slurries.
- Grooved design enhances process uniformity and prevents wafer slip.
- High mechanical stability to maintain planarity under polishing pressure.
- Low particulate generation to maintain wafer cleanliness.
Application Scenarios:
- Applied in AMAT Mirra and Reflexion CMP systems for 300mm wafer planarization.
- Used in dielectric, metal, and STI (Shallow Trench Isolation) polishing processes.
