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AMAT 5000-138

Product Name: Internal Retaining Ring (Lug Style)
Product Description: A precision stamped retaining ring designed for securing cylindrical components in internal grooves. It provides high axial load capacity in compact spaces.
Technical Specifications:
  • Material: 316L stainless steel (passivated)

AMAT 0020-75580

Product Name: Wafer Lift Pin Guide Assembly
Product Description: A precision linear guide system for wafer lift pins. It ensures smooth, vertical travel of lift pins, preventing wobble and particle generation during wafer elevation.
Technical Specifications:
  • Material: 316L stainless steel (body), PEEK (guide bushings)

AMAT 0020-54777

roduct Name: ESC Pedestal Insulator Ring
Product Description: A high-purity ceramic ring that provides electrical isolation between the ESC pedestal and the grounded chamber body. It prevents RF leakage and ensures stable electrostatic clamping.
Technical Specifications:
  • Material: 99.9% high-purity alumina (Al₂O₃)

AMAT 0020-54777

Product Name: ESC Pedestal Insulator Ring
Product Description: A high-purity ceramic ring that provides electrical isolation between the ESC pedestal and the grounded chamber body. It prevents RF leakage and ensures stable electrostatic clamping.
Technical Specifications:
  • Material: 99.9% high-purity alumina (Al₂O₃)

AMAT 0020-38890

Product Name: DPS Cathode Chamber Cover
Product Description: A heavy-duty, precision-machined aluminum cover that forms the top closure of the DPS (Dielectric Plasma Etch) chamber. It provides a vacuum-tight seal, houses the upper electrode feedthrough, and supports the showerhead assembly.
Technical Specifications:
  • Material: Forged 6061-T6 aluminum alloy

AMAT 0200-36524

Product Name: High-Purity Quartz Gas Distribution Nozzle
Product Description: A precision-formed fused quartz nozzle that delivers process gases directly to the wafer edge. It ensures uniform gas flow and prevents thermal shock to the wafer edge during high-temperature deposition.
Technical Specifications:
  • Material: High-purity synthetic fused silica (SiO₂ > 99.998%)

AMAT 0021-17725

Product Name: 200mm ESC Shutter Disk Assembly
Product Description: A precision-machined disk shutter designed to protect the 200mm Electrostatic Chuck (ESC) surface from plasma exposure, particle contamination, and physical damage during wafer transfer, idle states, and maintenance procedures.
Technical Specifications:
  • Material: High-purity 6061-T6 aluminum alloy

AMAT 0020-31292

Product Name: Gas Distribution Manifold / Injector Assembly
Product Description: A multi-channel precision manifold that mixes and distributes multiple process gases to the chamber showerhead. It ensures precise gas ratios and uniform dispersion for stable deposition/etch processes.
Technical Specifications:
  • Material: Electropolished 316L stainless steel

AMAT 1059-59425

Product Name: High-Frequency RF Cable Assembly (Low-Loss)
Product Description: A high-performance, shielded RF coaxial cable assembly designed for transmitting high-power RF signals between the RF generator and process chamber matching network.
Technical Specifications:
  • Cable Type: Low-loss, flexible 50Ω coaxial (RG-214 equivalent)

AMAT 0227-05442

Product Name: Precision Bellows Assembly (Linear Motion)
Product Description: A multi-ply, flexible metal bellows assembly that provides hermetic vacuum sealing for linear motion components (e.g., lift pins, gate valves). It allows axial movement while maintaining UHV integrity.
Technical Specifications:
  • Material: 316L stainless steel (multi-ply convoluted)

AMAT 0020-96815

Product Name: Lower Chamber Shield / Deposition Baffle
Product Description: A one-piece, cylindrical aluminum shield installed in the lower chamber section. It protects the chamber base and pump port from coating buildup and optimizes gas flow dynamics.
Technical Specifications:
  • Material: High-purity 6061-T6 aluminum

AMAT 0021-08845

Product Name: Wedge Post / Spider Assembly (Wafer Support)
Product Description: A multi-leg, ceramic-coated metallic assembly that supports the wafer edge during high-temperature processes. It provides stable, low-contact wafer support and allows for uniform thermal transfer.
Technical Specifications:
  • Material: Stainless steel core with high-purity alumina coating