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AMAT 0021-26276

Product Name: High‑Purity Quartz & Ceramic Process Kit Component
Product Description: A precision component made of ultra‑high‑purity quartz or advanced ceramic, used as gas distribution ring, focus ring, insulation ring, process kit insert and optical window in the process chamber to ensure process stability and low contamination.
Technical Specifications:
  • Material: Ultra‑high‑purity fused silica quartz, high‑purity alumina ceramic or silicon carbide

AMAT 0190-24298

Product Name: High‑Power RF Coaxial Cable & Transmission Assembly
Product Description: A professional high‑power, low‑loss RF coaxial cable assembly designed for semiconductor plasma equipment, used to transmit high‑power RF energy from RF generator to matching network and process chamber, ensuring stable plasma excitation.
Technical Specifications:
  • Impedance: Standard 50Ω impedance matching

AMAT 0040-38858

Product Name: Utility Interface Panel & Gas Distribution Manifold
Product Description: A centralized interface panel and gas distribution manifold used for process chamber utility connection, realizing the integrated access of process gas, purge gas, vacuum pipeline, cooling water circuit and signal circuit, and ensuring the stability and safety of fluid and electrical transmission.
Technical Specifications:
  • Material: 316L stainless steel, electropolished aluminum alloy

AMAT 0040-09312

Product Name: Main Vacuum Chamber Body & Structural Shell Assembly
Product Description: The main structural shell and vacuum cavity body of semiconductor process equipment, providing a closed ultra‑high vacuum environment for wafer processing. It integrates various functional interfaces and has high structural rigidity and vacuum integrity.
Technical Specifications:
  • Material: Low‑outgassing high‑strength aluminum alloy or 316L stainless steel

AMAT 0020-85925

Product Name: Process Chamber Shield & Liner Assembly
Product Description: A consumable shield and liner component installed inside the vacuum process chamber, used to protect the chamber body from plasma bombardment and chemical corrosion, collect process byproducts, optimize gas flow and plasma distribution, and maintain process stability and chamber cleanliness.
Technical Specifications:
  • Material: High‑purity anodized aluminum, 316L stainless steel, silicon carbide or ceramic composite

AMAT 0021-70220

Product Name: High‑Purity Ceramic Electrical Insulator & Plasma Isolation Component
Product Description: A high‑performance electrical insulation and plasma isolation component made of ultra‑high‑purity ceramic materials, used to isolate high‑voltage RF circuits, block plasma leakage, support internal components and prevent electrical breakdown in process chambers.
Technical Specifications:
  • Material: High‑purity alumina (Al₂O₃), yttria‑stabilized zirconia (YSZ) or boron nitride composite ceramic

AMAT 0010-47882

Product Name: Multi‑Zone Heater Pedestal & Wafer Support Assembly
Product Description: An integrated wafer support heater assembly with multi‑zone independent temperature control, used to provide precise and uniform thermal environment for wafers in thin film deposition and etching processes. It integrates heating, support and RF bias functions to meet complex process requirements.
Technical Specifications:
  • Temperature Control Range: Room temperature to 600°C

AMAT C190238

Product Name: Precision Machined Structural Component & Positioning Subassembly
Product Description: A customized high‑precision mechanical structural part developed for semiconductor wafer handling and chamber motion systems. It is used for precise positioning, load bearing, motion guidance and structural connection in automated material handling systems, ensuring the stability and repeatability of wafer transmission.
Technical Specifications:
  • Material: Aerospace‑grade 6061‑T6 aluminum alloy, 316L stainless steel optional

AMAT 0041-13111

Product Name: 300mm Electrostatic Chuck (ESC) Pedestal Subassembly
Product Description: This component is a high‑precision electrostatic chuck assembly dedicated to semiconductor wafer processing equipment, used to achieve non‑contact clamping, precise temperature control and stable support for 300mm wafers in high vacuum and plasma environments. It is a core component to ensure wafer position accuracy and process repeatability.
Technical Specifications:
  • Wafer Compatibility: 300mm monocrystalline silicon wafers and compound semiconductor wafers

AMAT 0190-07908

Product Name: Four-Channel DeviceNet Interface PCB
Product Introduction: A high-performance four-channel DeviceNet interface printed circuit board assembly (SST-DNP-CPCI-3U-4-NC) designed for industrial communication in semiconductor manufacturing equipment.
Technical Specifications:
  • Interface: Four-channel DeviceNet communication ports

AMAT 0100-90491

Product Introduction: A high-performance field control processor module designed for real-time control and monitoring of semiconductor manufacturing equipment subsystems, enabling precise process management.
Technical Specifications:
  • Processor: High-speed microcontroller for real-time computation

AMAT 0100-00991

Product Name: Orienter Interlock PCB for XR80 Implanter
Product Introduction: A dedicated printed circuit board assembly designed for AMAT XR80 ion implanter systems, providing safety interlock control and monitoring for wafer orienter mechanisms.
Technical Specifications:
  • Input Voltage: 24V DC industrial power supply