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AMAT 0010-22012
Product Name: Electrostatic Chuck (ESC) Pedestal Assembly
Product Description: A high-performance wafer clamping and heating pedestal integrating electrostatic chucking technology with precise thermal control. It provides non-contact wafer clamping, uniform heating, and RF bias delivery for advanced semiconductor processes.
Technical Specifications:
- Wafer Size: Compatible with 200mm wafers
Detailed content
- Chucking Type: Dual-zone Coulomb / Johnsen-Rahbek hybrid electrostatic clamping
- Temperature Range: 50°C to 450°C
- Temperature Uniformity: ±1.5°C across wafer surface
- Heating Element: Embedded, high-purity resistance heating coils
- RF Compatibility: Supports 13.56MHz RF bias for plasma processes
- Materials: High-purity aluminum nitride (AlN) ceramic top layer, titanium alloy base
Key Features:
- Uniform electrostatic force distribution eliminates wafer slip or edge chipping
- Rapid thermal response with precise multi-zone control
- High thermal conductivity ceramic ensures efficient heat transfer to wafer
- Excellent plasma erosion resistance and chemical inertness
- Built-in thermocouples for real-time temperature monitoring and closed-loop control
Application Scenarios:
Deployed in AMAT Centura and Endura platforms for dielectric etch, PECVD, and metal etch processes. Critical for advanced node manufacturing requiring tight temperature control and stable wafer clamping.
