Digital guide
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AMAT 0242-85548
Product Name: He Dump / Cooling System Retrofit Kit
Product Description: A comprehensive upgrade kit designed to retrofit existing helium cooling systems for improved thermal control efficiency. It includes upgraded components to enhance heat extraction from wafer pedestals.
Technical Specifications:
- Kit Contents: Upgraded heat exchanger, precision flow control valve, pressure transducers, high-purity tubing, and installation hardware
Detailed content
- Gas Compatibility: High-purity helium (He) coolant gas
- Pressure Range: 0–100 Torr (process-dependent)
- Temperature Range: Compatible with pedestal temperatures up to 500°C
- Materials: 316L stainless steel wetted parts, VCR connections
- Cleanliness: UHP cleaned, assembled in Class 10 cleanroom
Key Features:
- Improves thermal coupling efficiency between wafer and pedestal
- Provides more stable and responsive temperature control
- Reduces helium consumption while maintaining cooling performance
- Precisely controls helium flow for uniform cooling across wafer
- Extends maintenance intervals and improves process repeatability
Application Scenarios:
Retrofit for AMAT 200mm / 300mm deposition and etch systems (Centura, Endura). Specifically for processes requiring tight thermal control, such as high-k dielectric deposition and advanced epitaxial processes.
