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AMAT 0100-02805

Product Name: Wafer Orienter Control PCB Assembly
Product Description: A dedicated printed circuit board designed to control the wafer orientation mechanism, ensuring precise alignment of silicon wafers prior to processing in semiconductor fabrication tools.
Technical Specifications:
  • Architecture: High-density multi-layer PCB with embedded microcontroller.

AMAT 0190-09378

Product Name: RF Match Network Assembly
Product Description: An automatic impedance matching network that efficiently couples RF power from the generator to the plasma load, ensuring maximum power transfer.
Technical Specifications:
  • Frequency: 13.56 MHz (standard), with options for 27.12 MHz or 400 kHz.

AMAT 0021-14344

Product Name: Chamber Shield / Focus Ring Assembly
Product Description: A consumable metallic or ceramic shield that focuses the plasma onto the wafer and protects the chamber walls from excessive deposition or sputtering.
Technical Specifications:
  • Material: High-purity Aluminum, Copper, or Stainless Steel (depending on process).

AMAT 0010-35350

Product Name: Main Control PCB Assembly
Product Description: A sophisticated printed circuit board that functions as the core control module for managing chamber I/O, motor drives, sensors, and process sequencing.
Technical Specifications:
  • Architecture: High-density, multi-layer PCB with surface-mount technology (SMT).

AMAT 0010-09105

Product Name: Pedestal / Electrostatic Chuck (ESC) Assembly
Product Description: A multi-functional assembly that supports, clamps (via electrostatic force), and precisely controls the temperature of the wafer during processing.
Technical Specifications:
  • Type: Dual-zone or single-zone electrostatic chuck (ESC).

AMAT 0010-02991

Product Name: Robot Blade Assembly (End Effector)
Product Description: A precision, lightweight robotic arm blade used for contactless handling of silicon wafers in semiconductor wafer processing systems.
Technical Specifications:
  • Material: Advanced ceramic (Al₂O₃/SiC) or carbon fiber composite for high strength-to-weight ratio.

AMAT 0040-42746

Product Name: Gas Distribution Plate (Showerhead)
Product Description: A critical component for uniformly distributing process gases across the wafer surface in chemical vapor deposition (CVD) and etch processes.
Technical Specifications:
  • Material: High-purity Aluminum, Silicon Carbide (SiC), or coated metal.

AMAT 0040-02154

Product Name: Chamber Liner Assembly
Product Description: A precision-machined metallic liner that forms the interior surface of a process chamber, protecting the chamber body and ensuring process purity.
Technical Specifications:
  • Material: High-grade 316L Stainless Steel or Aluminum.

AMAT 0620-01694

Product Name: Cable Label Assembly
Product Description: A high-durability identification label system for precise cable management and traceability within complex semiconductor tool wiring harnesses.
Technical Specifications:
  • Material: High-temperature resistant, chemical inert polymer (Kapton/PEEK).

AMAT 0200-11342

Product Name: Ceramic Edge Ring
Product Description: A high-purity ceramic component designed to confine the plasma and protect the wafer edge during semiconductor deposition and etching processes.
Technical Specifications:
  • Material: High-purity alumina (Al₂O₃) or Yttria-stabilized Zirconia (YSZ).

AMAT 0140-70093

Product Name: Pump Interconnect Cable Assembly
Product Description: A high-performance electrical cable assembly designed for reliable signal and power transmission between vacuum pumps and the main control unit in semiconductor processing equipment.
Technical Specifications:
  • Material: High-purity, low-outgassing insulation and jacketing (FEP/PFA) for vacuum compatibility.

AMAT 0010-75509

Brand & Part Number: Applied Materials (AMAT) 0010-75509

Product Name: Wafer Lift Pin Assembly
Product Description: A precision-machined assembly for vertically lifting wafers from electrostatic chucks during processing cycles.