Digital guide
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AMAT 0041-89200
Product Name: Dual-Zone Electrostatic Chuck Heater Assembly
Product Description: An integrated heating element assembly embedded within electrostatic chucks (ESC), providing precise, dual-zone temperature control for wafers during advanced semiconductor deposition and etching processes.
Technical Specifications:
- Heating Element: High-purity tungsten resistance heating circuit
Detailed content
- Substrate Material: Aluminum nitride (AlN) ceramic with high thermal conductivity
- Temperature Range: 50°C to 450°C, dual-zone independent control
- Temperature Uniformity: ±2°C across wafer surface
- Power Rating: 1.2kW, 24V DC
- Insulation Resistance: ≥1000MΩ at 500V DC
Functional Features:
- Delivers precise dual-zone temperature regulation for optimal process results
- Rapid heat-up and response time with minimal temperature overshoot
- Uniform heat distribution across wafer to improve process uniformity
- Excellent thermal stability during long process cycles
- Hermetically sealed construction for vacuum compatibility
Application Scenarios: Used in advanced PVD, CVD, and ALD chambers with electrostatic wafer clamping systems on Centura and Endura platforms.
