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AMAT 0200-36122
Product Name: High-Temperature Resistant Ceramic Chamber Shield
Product Description: A single-piece ceramic shield component that lines the upper chamber region, protecting chamber walls from high-temperature plasma and deposition byproducts during advanced semiconductor processes.
Technical Specifications:
- Material: High-purity yttria-stabilized zirconia (YSZ)
Detailed content
- Temperature Rating: Continuous service up to 800°C
- Coating: Yttrium oxide (Y₂O₃) plasma-resistant surface layer
- Wall Thickness: Uniform 6mm construction
- Surface Finish: Precision ground, Ra ≤0.5μm
- Fitment: Designed for 300mm process chambers
Functional Features:
- Exceptional resistance to fluorine and chlorine plasma erosion
- High mechanical strength to resist thermal stress and vibration
- Low particle generation to maintain ultra-clean process conditions
- Effective thermal barrier to protect chamber body
- Direct replacement design for simplified maintenance
Application Scenarios: Applied in high-temperature dielectric etch, metal etch, and PECVD chambers requiring advanced plasma resistance.
