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AMAT 0050-32172

Product Name: CMP Polishing Pad and Retaining Ring Kit

Product Introduction:
This kit includes consumable components for Applied Materials’ Mirra or Reflexion Chemical Mechanical Planarization (CMP) systems. The kit typically consists of a polyurethane polishing pad (often with a fixed-abrasive or slurry-based surface) and a retaining ring made of a composite material. The pad provides the mechanical abrasion while the retaining ring holds the wafer against the pad to ensure uniform material removal across the entire wafer surface.

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Detailed content

Technical Specifications:

  • Pad Material: Polyurethane with specific hardness (Shore D 50-70), compressibility, and groove patterns (spiral or concentric).
  • Retaining Ring Material: Phenolic resin or polymer composite with high wear resistance.
  • Pad Dimensions: Standard 20-inch or 24-inch diameter platen compatibility.
  • Slurry Compatibility: Designed for oxide, metal (Cu/W), or slurry-specific chemistries.
  • Life Expectancy: Measured in number of wafers polished (typically 50-200 wafers depending on the material being removed).

Functional Features:

  • Global Planarization: Capable of removing topography to create a perfectly flat surface for subsequent lithography layers.
  • Material Selectivity: Pad chemistry is tuned to remove specific materials (e.g., oxide) while stopping on others (e.g., silicon nitride) with high selectivity.
  • Defect Reduction: Advanced pad conditioning (diamond dresser) integration maintains pad roughness and prevents glazing.
  • Wafer Retention: The retaining ring applies controlled down-force to prevent wafer edge lift-off, ensuring edge-to-edge uniformity.
  • Slurry Distribution: Pad grooves are engineered to transport slurry efficiently across the wafer interface.

Application Scenarios:

  • Shallow Trench Isolation (STI): Planarizing oxide fill in isolation trenches.
  • Inter-Layer Dielectric (ILD): Smoothing layers between metal interconnects.
  • Copper Damascene: Removing excess copper (overburden) after electroplating and stopping at the barrier layer.
  • Tungsten Plug: Polishing back tungsten used for vertical interconnects (vias/contacts).
  • Advanced Packaging: Thinning wafers for 3D stacking and TSV reveal.

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