Digital guide
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Yokogawa SD1006B04‑2/00S05DYNAV
- Product Name: SD Series Digital Data Acquisition Module / DYNAV Dynamic Measurement Module
- Product Series: SD Series High‑Speed Data Acquisition & Logging Module
- Technical Specifications: Channel quantity: 6‑channel analog input; Sampling rate: up to 100 kHz per channel; Input range: ±10 V standard; Resolution: 16‑bit; Communication interface: Ethernet; Power supply: 24 VDC
Detailed content
- Functional Features: High‑speed dynamic signal collection; Real‑time data storage; Ethernet data transmission; Multi‑channel synchronous sampling; Digital filtering function; Time‑stamped data logging
- Performance Parameters: Measurement accuracy: ±0.02% FS; Channel‑to‑channel synchronization error ≤1 μs; Operating temperature: -10 °C to +60 °C; EMC compliance with IEC61000‑6‑2
- Material Composition: Aluminum alloy shielding housing; High‑precision A/D conversion chips; Gold‑plated signal terminals; Heat‑resistant PCB circuit board
- Structural Characteristics: Compact rack‑mount modular structure; Front‑panel status indicator lights; Detachable terminal wiring blocks; Internal heat‑dissipation fin structure
- Working Principle: Converts analog dynamic process signals to digital signals via high‑speed A/D converter; Processes and stores data through internal MCU; Transmits real‑time measurement data to upper computer via Ethernet protocol
- Advantage Highlights: Ultra‑high sampling speed; Precise multi‑channel synchronization; Strong anti‑electromagnetic interference performance; Compact size for space‑limited installation
- Applicable Industries: Automotive testing; Aerospace engineering; Mechanical vibration monitoring; Energy equipment testing; Industrial dynamic process monitoring
- Installation Requirements: DIN‑rail rack‑mount installation; Ambient air circulation required; Separate power and signal wiring paths; Ground terminal reliable connection
- Usage Precautions: Prevent electrostatic discharge damage during wiring; Avoid overvoltage input exceeding rated range; Regular check of communication connection stability; Keep internal circuit board dust‑free
