Tokyo Electron 1381-648241-15
Product Name
Mark 8 Interface and Control PCBA
Product Introduction
This board is an interface and control printed circuit assembly for TEL Mark 8 eight-inch track systems. It manages internal signal routing, power distribution, and subassembly communication across the processing deck.
Detailed content
Technical Specifications
Manufacturer is Tokyo Electron. Part number is 1381-648241-15. System application is TEL Mark 8 eight-inch track. Board type is interface or control PCBA. Interface topology uses multipin backplane and harness connections. Recommended cleanroom equipment enclosure environment is 15°C to 30°C, non-condensing.
Functional Features
The board provides multilayer signal routing, enhanced noise filtration, high-density edge connectors, and revised circuit refinements over earlier dash numbers where approved by the system configuration.
Application Scenarios
Use the board for Mark 8 track internal communication, interlock signaling, and deck power or control distribution. It is intended for legacy eight-inch semiconductor track maintenance and spare-parts replacement.
Structural Characteristics
The assembly uses a multilayer printed circuit with high-density connectors, surface-mount components, and industrial PCBA construction for cleanroom racks.
Working Principle
The controller sends power and communication signals through the backplane. The board distributes those signals to deck subsystems, interlock circuits, and sensor or actuator interfaces, then returns status to the host track computer.
Installation Requirements
Install only in the designated Mark 8 slot or subsystem. Cross-check the dash-number revision against tool software and hardware manuals. De-energize the rack or deck before insertion. Inspect all multipin connectors before seating.
Usage Precautions
Do not hot-plug the board with active power. Seat all harnesses completely to avoid sensor errors or interlock trips. Do not use an incompatible revision as a direct replacement without system verification. For multilayer faults, replace the whole board rather than attempting component-level field repair.













