Digital guide

You are here:

Texas Instruments TPD4E001

Product Name:​ TPD4E001 4-Channel Low-Capacitance ESD Protection Array
Introduction:​ This device is a transient-voltage-suppression diode array designed to protect high-speed data and sensitive analog lines from electrostatic discharge. Each channel steers ESD current toward VCC or ground through clamp diodes.

Detailed content

Technical Specifications:​
  • Channels: 4
  • Supply voltage range: 0.9 to 5.5 V
  • I/O capacitance: 1.5 pF typical per channel
  • Leakage current: 1 nA maximum
  • Diode forward voltage at 10 mA: 0.65 to 0.95 V
  • Breakdown voltage at 10 mA: 11 V typical
  • Peak pulse current, 8/20 µs: 5.5 A
  • Peak pulse power, 8/20 µs: 100 W
  • Packages: DRL, DBV/SOT-23, DCK/SC-70, DRS/QFN
  • Operating temperature: -40 to 85 °C
ESD Ratings:​
  • IEC 61000-4-2 contact discharge: ±8 kV
  • IEC 61000-4-2 air-gap discharge: ±15 kV
  • Human Body Model: ±15 kV
Material Composition:​ Silicon ESD clamp diodes, lead-frame terminals, mold compound package, gold or solderable finish depending on package.
Structural Features:​ Small-outline rail-to-rail protection array, independent channels, low parasitic capacitance, space-saving pinouts for high-density PCBs.
Working Principle:​ An incoming ESD transient forward-biases the steering diodes so excess energy is routed to the supply rail or ground plane. The low-capacitance structure preserves signal integrity on USB, Ethernet, FireWire, SVGA and precision analog traces.
Application Scenarios:​ USB 2.0 ports, Ethernet interfaces, FireWire links, precision measurement inputs, SVGA video lines, mobile and consumer electronics.
Installation Requirements:​ Place the array close to the connector, connect VCC and GND planes with low-inductance paths, match package land pattern to PCB design rules, and avoid long stub traces between protected line and diode.
Usage Precautions:​ Ensure supply bypass capacitor stability, confirm I/O voltage never exceeds clamp rating, use correct package orientation, and store in moisture-controlled conditions before reflow.

You may also like