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Lam Research 810-072906-005
Product Name
Connector Backplane PCB / Signal Distribution Board. Select spare-part sources also list 810-072906-005 as RF matching network; verify BOM.
Product Introduction
As a backplane, the board provides central interconnect for signal routing, power distribution, and communication between modules in Lam Research semiconductor equipment. As an RF matching variant, it performs impedance matching between RF source and plasma chamber.
Detailed content
Technical Specifications – Backplane Version
Product Type: Connector backplane PCB.
Brand: Lam Research.
Function: Signal routing, power distribution, module communication.
Construction: Industrial-grade multilayer PCB.
Protection: ESD-safe handling, high-reliability interconnect.
Application: Semiconductor manufacturing equipment and automation systems.
Technical Specifications – RF Match Version
Product Type: Automatic RF impedance matching network.
Frequency: Listed dual-frequency sources cite 2 MHz and 13.56 MHz.
Application: 300 mm Lam etch chambers.
Function: Match RF generator output to plasma load for maximum power transfer.
Installation: RF cabinet or chamber RF line according to BOM.
Functional Features
Backplane: multi-channel routing, stable power distribution, backplane communication, and modular replacement. RF match: automatic tuning, reflected-power reduction, frequency-specific impedance correction, and diagnostic communication.
Structure Characteristics
Backplane: rigid PCB with multiple connectors, power planes, signal traces, and mounting hardware. RF match: RF input/output ports, tuning components, sensors, controller interface, and rack-mount enclosure.
Working Principle
Backplane routes control and power signals between inserted modules through defined connectors and planes. RF match measures load impedance and adjusts tuning elements to maintain target matching condition during plasma process.
Application Scenarios
Lam Research etch and deposition tool racks, control backplanes, RF generator-to-chamber matching, dual-frequency plasma systems, and fab spare-parts maintenance inventory.
Installation Requirements
Backplane: power down entire chassis, photograph all cables and jumper settings, align board with guide rails, seat connectors fully, torque fasteners to specification. RF match: install in RF line with correct frequency rating, verify cooling, perform autotune and calibration with RF meters.
Usage Precautions
Do not hot-swap backplane in non-supported slots. Verify firmware or revision compatibility. For RF version, do not operate without cooling and RF cabling verification. Inspect insulation resistance and ground continuity before energizing.
Source Note
Because public listings describe 810-072906-005 as both backplane and RF matching network, identify the installed assembly type from equipment model, BOM, and Lam engineering drawing before use.
