Technical Specifications:​ Base material aluminum alloy 6061-T6, plasma-resistant coating yttria-stabilized zirconia, reported coating thickness 150–300 µm, orifice diameter approximately 0.5–1.5 mm, maximum operating temperature up to 350°C, machined surface finish Ra ≤0.8 µm and coated surface finish Ra ≤1.6 µm, wafer compatibility 200 mm and 300 mm platforms.

Performance Parameters:​ Uniform gas distribution through a precision orifice array, stable operation under reactive plasma chemistry, compatibility with reported LAM 2300, Flex, Polygon and related etch platforms.

Materials And Structure:​ Machined 6061-T6 aluminum body, full or patterned YSZ ceramic coating on plasma-facing surfaces, engineered orifice pattern, mounting holes, gas inlet interface and seal/O-ring grooves.

Working Principle:​ Process gas enters the inlet manifold, passes through the coated orifice array and forms a uniform flow field into the plasma chamber, producing even radical distribution and consistent etch rate across the wafer.

Application Scenarios:​ Dielectric and conductor dry etching, 200 mm and 300 mm wafer fabs, high-density plasma etch chambers.

Installation Requirements:​ Place the etch tool in approved maintenance state, isolate electrical, pneumatic, vacuum, RF and process-gas sources, confirm safe chamber temperature, work under cleanroom procedure, inspect orifice pattern, mounting holes, gas inlet geometry, seal grooves and coating condition, use torque-controlled tools and compare the new part dimensionally with the removed part.

Usage Notes:​ Verify part marking, coating condition and chamber revision before installation. Replace damaged, eroded or contaminated showerheads according to the equipment maintenance plan. Conduct chamber conditioning and qualification runs after replacement.