Technical Specifications​

Supported processors: Intel Core Duo 1.2/1.66/2.0 GHz and Intel Core2 Duo 1.5/2.16 GHz options

Chipset: Intel 945GM graphics memory controller with ICH7R I/O controller

Memory: DDR2 SDRAM 533/667 MHz, up to 4 GB total using soldered memory and SO-DIMM socket

Graphics: integrated 945GM controller with VGA and optional DVI

Ethernet: 2 × Gigabit RJ45, Intel 82573L

USB: up to 6 × USB 2.0 depending on 4HP/8HP configuration

Storage: CompactFlash Type I/II via CF module, SATA/SATA-II interfaces, optional 2.5-inch drive carrier

Serial and legacy: COM port, PS/2, LPC and rear I/O on 8HP versions

Bus: CompactPCI 3U, 32-bit/33 MHz system master, PICMG 2.0 and hot-swap options

Functional Features​

Passive or controlled cooling according to processor and heatsink option. Wide-temperature 1.2 GHz version supports -40 to +85 °C. Dual independent displays through VGA and DVI. Watchdog timer, EEPROM board identification, BIOS console redirection and CompactFlash/SSD boot. Real-time operating-system support through vendor BSPs.

Application Scenarios​

Industrial CompactPCI systems, transportation control, defense and aerospace ground equipment, telecommunications servers, machine HMI hosts, test systems and long-life embedded controllers.

Performance Parameters​

L2 cache: up to 2 MB for Core Duo or up to 4 MB for Core2 Duo

Front-side bus: 533 or 667 MHz according to CPU

Display resolution: up to 2048 × 1536 on VGA, 1024 × 768 or higher on DVI depending on carrier

Operating temperature: 0 to +60 °C for standard builds, -40 to +85 °C for specified wide-temperature 1.2 GHz build

Storage temperature: -55 to +85 °C typical CompactPCI version

Dimensions: 100 × 160 mm CompactPCI 3U front profile; 4HP or 8HP depth by variant

Weight: approximately 320 g for 4HP, 400 g for 8HP

Material Composition​

PCB: industrial multilayer FR4 with lead-free finish

Heatsink: aluminum cooling solution matched to processor TDP

Connector bodies: standard CompactPCI gold-contact edge and rear-I/O connectors

Chassis compatibility: 3U CompactPCI metal frame and conducting housing parts

Structural Characteristics​

4HP version provides front VGA, two USB, two Gigabit Ethernet and status LEDs. 8HP version adds DVI, COM, PS/2, extra USB, reset and 2.5-inch SATA carrier. Rear I/O follows PICMG 2.0 J1/J2 pinning for backplane integration. Hot-swap support available under PICMG 2.1 according to configuration.

Working Principle​

The processor executes the operating system and application software. Northbridge graphics serve HMI and display outputs. Gigabit Ethernet, USB, SATA and serial interfaces handle communication and storage. CompactPCI backplane transfers system control, I/O and peripheral data. Watchdog and BIOS diagnostics monitor boot health and system faults.

Installation Requirements​

Mount in a standard 3U CompactPCI rack with correct 4HP or 8HP slot allocation. Verify processor, memory and cooling option before insertion. Connect rear J1/J2 backplane according to the system schematic. Provide 5 V and 3.3 V CompactPCI power or external regulated supply as defined by the carrier. Ensure airflow meets the processor’s temperature rating.

Usage Precautions​

Use only supported operating-system BSPs for CP307. Do not mix 4HP and 8HP rear-I/O expectations without checking the backplane. Keep CompactFlash and SSD images backed up before firmware or BIOS changes. Inspect cooling fins and fan modules periodically in high-dust environments. Remove power before replacing CF, memory or mezzanine modules.