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TOKYO ELECTRON 1R81-602755-13
Product Overview
The 1R81-602755-13 is a precision-manufactured spare part for Tokyo Electron semiconductor wafer-processing equipment. It performs a mechanical, electrical or gas-circuit transfer function inside the wafer-fabrication chamber and is a replaceable component for semiconductor production tools. Exact functional identification must be confirmed against the TEL spare-parts catalogue or equipment service manual.
Detailed content
Technical Specifications
Operating temperature: -20 °C to +80 °C
Operating pressure: vacuum to positive pressure
Maximum positive pressure: 0.6 MPa
Dimensional tolerance: ±0.02 mm
Surface roughness: Ra 0.8 μm
Weight: 145 g
Dimensions: custom precision dimensions matched to the equipment chamber interface
Cleanroom assembly requirement: ISO Class 1
Vacuum leak rate: 1 × 10^-9 Pa·m³/s or lower
Cycle service life: 25,000 equipment-operation cycles or greater
Functional Features
Precision dimensional consistency for vacuum sealing
Anti-corrosion surface treatment for resistance to process specialty gases
Controlled out-gassing characteristics
Modular plug-in structure for rapid replacement
Full dimensional traceability for semiconductor-grade cleanliness
Material Composition
Base material: aerospace-grade aluminium alloy
Surface treatment: hard-coat anodised anti-corrosion film
Sealing auxiliary material: high-purity fluoropolymer
Structural Features
One-piece precision-machined structure
Multi-position locating-pin arrangement
Integral flow channel or wiring channel matched to the original equipment interface
Working Principle
The component performs mechanical positioning, gas conduction or electrical-signal transmission inside the semiconductor process chamber. It cooperates with other chamber components to maintain the high-purity vacuum environment required for wafer etching and thin-film deposition.
Application Scenarios
TEL etch and deposition equipment wafer-process chambers
Internal assemblies in TEL track, etch, clean and deposition tools
Eight-inch and twelve-inch semiconductor wafer-fabrication lines
Routine maintenance and spare-part replacement on semiconductor foundry equipment
Installation Requirements
Complete installation inside an ISO Class 1 to ISO Class 10 cleanroom
Use special-tool torque control and follow the equipment service manual
Inspect sealing surfaces for scratches and particle contamination before assembly
Complete a vacuum leak test after installation
Handle the part as a contamination-controlled precision component
Usage Notes
Confirm the exact functional drawing and revision before replacement
Do not substitute a geometrically similar part without TEL engineering approval
Controlled out-gassing and particle cleanliness are essential to wafer yield
Follow TEL’s spare-parts and repair documentation for genuine-part performance
