Technical Specifications – RF MMIC Configuration​

Manufacturer listing: Texas Micro Devices, referenced under MACOM-related RF distribution

Frequency range: DC to 6 GHz

Gain: 22 dB ±1.5 dB

Output P1dB: +18 dBm typical

Output IP3: +28 dBm typical

Noise figure: 3.5 dB typical at 1 GHz

Supply voltage: +5 VDC single supply

Supply current: 180 mA typical

Package: 14-pin hermetic ceramic DIP, 0.3 by 0.6 inch outline

Substrate: GaAs semi-insulating wafer

Die attach: AuSn eutectic

Wire bonds: 1 mil gold

Interface: RF input and output, DC bias, ground per 14-pin ceramic layout

Technical Specifications – Alternate VPX Computer Configuration​

Manufacturer listing: Texas Micro Systems rugged embedded platforms

Architecture: 6U VPX

Processors: PowerPC or ARM multicore options per build

High-speed fabric: Serial RapidIO and PCIe Gen4

Operating temperature: -40°C to +85°C

Reliability: MIL-STD-810G shock and vibration qualification, MTBF greater than 100,000 hours in listed rugged builds

Technical Specifications – Alternate Semiconductor Control Board Configuration​

Manufacturer listing: Trenton Technologies builds for KLA, related 92-005649-XXX control boards

Function: single-board computer for wafer inspection and metrology

Tasks: CPU control, image acquisition coordination, motion control, defect-analysis data processing

Functional Features​

The RF configuration provides wideband gain with low noise and linear output for radar, electronic-warfare, and satellite links. The VPX configuration provides real-time computing with high-speed serial fabrics in harsh platforms. The semiconductor configuration provides centralized inspection-system control and data handling.

Application Scenarios​

RF configuration: electronic warfare, radar front ends, satellite communication, wideband test equipment. VPX configuration: aerospace computing, shipboard radar processing, unmanned vehicle control, industrial edge computing. Semiconductor configuration: wafer defect inspection, critical-dimension measurement, process metrology.

Material And Structure​

The RF device uses GaAs die in hermetic alumina ceramic with gold interconnects and AuSn attachment. The VPX module uses conduction-cooled metal carrier, multilayer PCB, and rugged connectors. The semiconductor board uses industrial PCB with processor, memory, FPGA or interface controllers, and system I/O.

Working Principle​

The RF MMIC amplifies incoming RF signals through GaAs gain stages and delivers matched output with bias stabilization. The VPX computer executes real-time software over high-speed serial switching fabrics. The semiconductor board runs system firmware that coordinates optics, sensors, motion, and data-processing subsystems.

Installation Requirements​

For the RF MMIC, mount in a grounded RF assembly with controlled impedance, provide +5 VDC regulated bias, and use RF grounding per the 14-pin ceramic layout. For VPX, insert into the specified 6U backplane with conduction-cooling frames and validate fabric firmware. For semiconductor boards, install in the qualified KLA controller chassis and load the approved system firmware.

Usage Precautions​

Do not apply voltages outside the +5 VDC RF bias specification. Prevent RF output mismatch that causes overdrive or thermal damage. For VPX and semiconductor boards, use ESD handling, approved firmware versions, and qualified backplane power only. Verify the exact 92-005649-00X revision label because RF, VPX, and semiconductor builds are not interchangeable.