Protocol: LonTalk / ANSI/CTA-709.1 according to listed source.

Onboard Core: Neuron chip for local I/O processing.

Digital Inputs: 16 channels, 24 VDC, optically isolated.

Digital Outputs: 16 channels, 24 VDC, open-collector, valve or indicator driving.

Supply Voltage: 24 VDC local supply according to one source; 24 VDC nominal ±10% with 12 W maximum according to another source.

Bus Speed: 78 kbps listed for node version.

Maximum Nodes: 64 on LonWorks segment according to listed source.

Indicators: Power, bus communication, and I/O activity LEDs.

Operating Temperature: 10°C–50°C per system-distribution listing; 10°C–50°C per LonWorks source; -20°C–60°C per alternate controller listing.

Storage Temperature: -20°C to 70°C or -40°C to 85°C according to source.

Function: Local sensor acquisition, solenoid valve driving, limit-switch monitoring, interlock reporting, and data exchange with VME or host controller.

Option B – System Distribution / Signal Interface PCB​

Product Type: Multilayer signal distribution and interface PCB.

Construction: Fiberglass multilayer board with copper traces, connector headers, and solder pad arrays.

Power: Low-voltage logic and distribution rails.

Platforms: Listed sources associate it with Lam 2300, Kiyo, and Vector systems.

Function: Signal routing, data transmission pathways, electrical isolation, and EMI suppression in control racks.

Option C – RF Match / Control Interface Listing​

Some sources list 810-082745-003 as dual-frequency RF match or VME control I/O interface. RF match listing cites 2 MHz and 27 MHz, automatic impedance matching, LonWorks or RS-485 communication, 24 VDC, forced-air cooling, and rack enclosure. VME listing cites 24 VDC logic supply, digital I/O, analog conditioning, and VME controller bay installation.

Working Principle​

LonWorks version processes local I/O and transmits status over fieldbus. Distribution version routes control and sensor signals between subsystems. RF match version tunes impedance between generator and plasma load. VME version exchanges I/O and control data through backplane.

Application Scenarios​

Lam etch and deposition tools, 2300/Kiyo/Vector platforms, gas box I/O, robot or valve local nodes, signal distribution cabinets, and RF matching cabinets according to BOM.

Installation Requirements​

Power down tool and relevant rack. Photograph node address, DIP switches, jumpers, and all connectors. Set firmware or node parameters identical to replaced board. Seat aligned with guides. For RF version, install in RF line, verify cooling, and run autotune calibration.

Usage Precautions​

Do not hot-swap. Do not mix LonWorks node, distribution, and RF match identities. Verify firmware, node ID, pinout, and platform compatibility. Test communication and I/O before resuming wafers.

Source Note​

Due to conflicting public identities for 810-082745-003, use the physical label, BOM number, platform, and Lam engineering documentation to determine the correct specification set.